Probe Card Temperature Stabilizer for Semiconductor Testing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Wafer probe apparatuses face alignment issues due to temperature fluctuations affecting the thin probe needles, leading to inaccurate readings and potential damage to semiconductor chips, which increases testing time and decreases productivity and yield.

Innovation Solution

A temperature stabilizer element is coupled to the probe card to control the temperature of the probe needles, using thermoelectric devices like Peltier elements to maintain them within a desired range, reducing movement and misalignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If thin probe needles are used to engage contact pads, then measurement precision is improved, but reliability deteriorates due to misalignment from temperature changes

Engineering Contradiction:
Improvealignment accuracyVSAvoidalignment stability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The patent applies temperature control to maintain the probe needle at a constant temperature, preventing thermal expansion or contraction that causes misalignment. By controlling the temperature parameter of the probe needle, the system maintains both measurement precision and alignment reliability during high-temperature wafer testing

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces a temperature control mechanism as an intermediary between the probe needle and the environmental temperature changes. This intermediary system actively compensates for temperature fluctuations, preventing direct thermal effects on the thin probe needle that would cause misalignment

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If additional testing time is taken to allow needle re-adjustment after temperature changes, then reliability is improved, but productivity deteriorates

Engineering Contradiction:
Improvealignment accuracyVSAvoidtesting throughput
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent implements preliminary temperature stabilization of the probe needle before testing begins and maintains it throughout the process. This preliminary action prevents temperature-induced misalignment from occurring in the first place, eliminating the need for post-temperature-change re-adjustment periods and maintaining high productivity

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The temperature control system operates continuously throughout the testing process, maintaining constant probe needle temperature. This continuous temperature stabilization ensures consistent alignment accuracy without interrupting the testing flow for re-adjustment, thereby maintaining both reliability and productivity

Inventive Principle:
Principle #20Continuity of useful action

3Device complexity

If probe needles are used without temperature control, then device complexity is reduced, but manufacturing precision deteriorates due to needle movement

Engineering Contradiction:
Improvesystem simplicityVSAvoidalignment precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent controls the temperature parameter of the probe needle to prevent thermal expansion or contraction. By maintaining constant temperature, the system prevents probe needle movement that would compromise alignment precision, while the temperature control mechanism is integrated in a way that minimizes added complexity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The temperature stabilizer effectively minimizes probe needle movement and misalignment, enhancing testing accuracy and reducing chip damage, thereby improving productivity and yield by maintaining consistent operability during semiconductor device testing.

Implementation Method 1

A temperature stabilizer element is couplable to the probe card. The temperature stabilizer is configured to either raise or lower a temperature of the probe needles

Methodology Applied
Scientific EffectThermoelectric effect: Peltier Effect

Implementation Method 2

The temperature stabilizer element is coupled to the probe card and is configured to either raise or lower a temperature of the probe needles

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7495458B2Probe card and temperature stabilizer for testing semiconductor devices
Publication Date: 2009.02.24 TEXAS INSTRUMENTS INC
  • US7495458B2 patent drawing
  • US7495458B2 patent drawing
  • US7495458B2 patent drawing

AI summary

One aspect of the invention provides an apparatus that includes a probe card having probe needles associated therewith. A temperature stabilizer element is couplable to the probe card. The temperature stabilizer is configured to either raise or lower a temperature of the probe needles to reduce movement of the probe needles.