Probe Card Deviation-Compensating Member Thermal Expansion

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Solution Overview

Problem

Probe cards face significant challenges in maintaining precise probe tip positions due to thermal radiation, leading to deviations in three-dimensional positions of needle tips at high temperatures, especially in multi-DUT setups, which affects electrical detection functions and increases debugging time.

Innovation Solution

A probe card design incorporating a deviation-compensating member with a different thermal expansion characteristic than the probes, connected through an adhesive member with through holes, automatically calibrates needle tip offsets by adjusting the thickness of the compensating member to maintain accurate probe mark locations at both room and high temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If probes are used for electrical testing at high temperatures, then electrical detection function is achieved, but needle tip position deviation occurs due to thermal expansion

Engineering Contradiction:

Improveelectrical detection functionVSAvoidneedle tip position accuracy

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies thermal expansion principles by selecting materials with different thermal expansion coefficients for the probe body and compensating structure. The probe body uses material with a first thermal expansion coefficient while the compensating structure uses material with a second thermal expansion coefficient that is greater than the first, allowing the compensating structure to expand more at high temperatures and thereby offset the positional deviation of the needle tip.

Inventive Principle:

Principle #37Thermal expansion

Solution Approach 2:

The patent changes the thermal expansion parameter by using materials with different thermal expansion coefficients. By carefully selecting materials where the compensating structure has a higher thermal expansion coefficient than the probe body, the system transforms the thermal expansion from a source of error into a compensation mechanism that maintains needle tip position accuracy across temperature variations.

Inventive Principle:

Principle #35Parameter changes

2Temperature

If probe card operates at high temperature, then testing capability is improved, but thermal radiation causes dynamic thermal stream affecting probe positions

Engineering Contradiction:

Improveoperating temperatureVSAvoidprobe mark location accuracy

Core Design Contradiction:

TemperatureVSMeasurement precision

Solution Approach 1:

The patent converts the harmful thermal radiation effect into a beneficial compensation mechanism. By designing a compensating structure made of material with higher thermal expansion coefficient, the structure intentionally expands more under thermal radiation to counterbalance and offset the positional deviations caused by the dynamic thermal stream, thereby transforming the harmful thermal effect into a useful compensation action.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Area of stationary object

If large probing area is designed for multi-DUT testing, then testing coverage is improved, but probe mark position deviation increases

Engineering Contradiction:

Improveprobing areaVSAvoidprobe mark location precision

Core Design Contradiction:

Area of stationary objectVSManufacturing precision

Solution Approach 1:

The patent applies segmentation by dividing the probe card into multiple independent probe assemblies, each with its own compensating structure. This allows each probe to independently compensate for thermal expansion effects, maintaining position accuracy across large probing areas for multi-DUT testing without the deviations accumulating across the entire array.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces needle tip offset deviations, ensuring accurate probe mark locations across temperature variations, reducing production abnormalities and debugging time, and facilitates effortless setup for multi-DUT testing without compromising probe alignment.

Implementation Method 1

The probes have a first thermal expansion characteristic, the deviation-compensating member has a second thermal expansion characteristic, and the first thermal expansion characteristic and the second thermal expansion characteristic are different

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

the chuck emits thermal radiation, which therefore affects metal behavior in the space near the chuck

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS9678110B2Probe card

Publication Date: 2017.06.13 GLOBAL UNICHIP CORPORATION

AI summary

A probe card includes a circuit board, a plurality of probes, and at least one deviation-compensating member. An end of each of the probes is connected to the circuit board. The deviation-compensating member is fixed to the circuit board and connected to the probes. The probes have a first thermal expansion characteristic, the deviation-compensating member has a second thermal expansion characteristic, and the first thermal expansion characteristic and the second thermal expansion characteristic are different.