Probe Pin With Overlapping Conduction Path for Tight Pitch
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing probe pins in inspection units face challenges in reducing the size and pitch within an array due to the widthwise gap between adjacent pins, making it difficult to miniaturize electronic component modules.
Innovation Solution
A probe pin design featuring a plate-like movable pin with a flexible part and a conduction-path forming element that overlaps the movable pin along its thickness, allowing for electrical connection and relative movement, which reduces the widthwise dimension and enables tighter packing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a movable contact piece is provided along the width of the movable part, then reliable electrical connection is achieved, but the widthwise gap between adjacent probe pins increases, making it difficult to reduce the pitch within an array of probe pins
Solution Approach 1:
The conduction-path forming element extends in the thickness direction (vertical dimension) rather than the width direction (horizontal dimension). By overlapping the movable pin along the thickness and providing contact surfaces at the end of the conduction-path forming element, the electrical connection is achieved without increasing the widthwise footprint, thereby enabling reduced pitch between adjacent probe pins while maintaining reliable contact
2Length of moving object
If the widthwise dimension of the probe pin is reduced, then the pitch within an array of probe pins can be reduced, but maintaining reliable electrical connection becomes more difficult
Solution Approach 1:
The invention transitions the conduction path from a horizontal arrangement to a vertical arrangement by extending the conduction-path forming element in the thickness direction. This allows the probe pin width to be minimized while the contact surfaces are positioned at the end of the conduction-path forming element to ensure reliable electrical connection between the movable pin and the fixed structure
Solution Approach 2:
The conduction-path forming element is positioned to overlap the movable pin along the thickness direction, creating a nested arrangement where the conduction path is contained within the vertical profile of the probe pin structure. This nesting allows the contact surfaces to engage reliably without requiring additional widthwise space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for a reduction in the size of individual probe pins and the pitch within arrays, facilitating the miniaturization of electronic component modules while maintaining reliable contact.
Implementation Method 1
a flexible part configured to expand and contract lengthwise
Data Source
AI summary
A probe pin is provided with a plate-like movable pin including: a flexible part configured to extend and contract lengthwise; a first contact part and a second contact part each provided at an end of the flexible part lengthwise; and a conduction-path forming element overlapping the movable pin along the thickness thereof. The conduction-path forming element includes a first contact surface and a second contact surface at lengthwise ends configured to contact the first contact part and second contact part; the movable pin and the conduction-path forming element are arranged to allow the first contact part to remain in contact with the first contact surface and the second contact part to remain in contact with the second contact surface while allowing relative movement of the movable pin and the conduction-path forming element lengthwise.