Probe Pin Thermocouple Layout for Localized Wafer Temperature Testing
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Solution Overview
Problem
Current semiconductor manufacturing and testing methods face challenges in efficiently testing tightly packed pads on semiconductor wafers due to the need for precise and delicate probe tips, which are expensive and prone to degradation, especially when dealing with high input/output count logic chips, and traditional large probe heads are unsuitable for high pin count applications.
Innovation Solution
The implementation of a system with probe pins equipped with thermocouples that allow for localized heating and cooling by applying voltage or current, utilizing the Peltier effect to control temperature, thereby enabling precise temperature control without subjecting the entire wafer to temperature testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional large probe heads are used for testing semiconductor wafers, then the testing capability is provided, but the probe tips are expensive and prone to degradation due to tight packing requirements
Solution Approach 1:
The patent replaces the mechanical probe tip contact system with a thermocouple-based thermal field system. Instead of relying on delicate mechanical probe tips to physically contact tightly packed pads, the invention uses thermocouples positioned between probe pins to create localized thermal fields that enable testing without direct mechanical contact, thereby eliminating probe tip degradation and cost issues
Solution Approach 2:
The invention changes the testing parameter from electrical contact through probe tips to thermal interaction through thermocouples. By applying voltage or current to the thermocouples, localized heating or cooling is achieved, transforming the testing mechanism from mechanical-electrical contact to thermal field interaction, which resolves the probe tip reliability and cost contradiction
2Reliability
If the entire wafer is subjected to temperature testing, then comprehensive testing is achieved, but localized heating and cooling control is lost
Solution Approach 1:
The patent applies local quality by positioning individual thermocouples between specific probe pins to create localized thermal zones. Each thermocouple can be independently controlled to heat or cool its local region, enabling precise temperature control at specific test locations on the wafer while maintaining comprehensive testing capability across the entire wafer surface
Solution Approach 2:
The invention segments the temperature control system into multiple independent thermocouples distributed across the wafer surface. Each thermocouple acts as an independent temperature control unit, allowing selective activation and control of specific regions. This segmentation enables both comprehensive coverage and localized precision in temperature testing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for efficient and cost-effective localized heating and cooling of semiconductor wafers, enabling precise testing of densely packed pads and reducing the need for expensive, high-maintenance large probe heads, making it suitable for high pin count applications.
Implementation Method 1
utilizing the Peltier effect to control temperature
Data Source
AI summary
A system includes probe pins each including a probe tip and a plurality of thermocouples arranged such that at least one thermocouple is positioned between a pair of the probe pins. The plurality of thermocouples can be placed adjacent or above a device under test (DUT). The probe tips of the probe pins are placed over a plurality of pads. The plurality of thermocouples are placed adjacent or between the plurality of pads. The at least one thermocouple positioned between the pair of the probe pins can be either a single thermocouple or a thermocouple array.