Probe Position Inspection Using Transparent Plate and Camera
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Solution Overview
Problem
Existing semiconductor device inspection methods face challenges in accurately determining probe position due to misalignment, background disturbances, and the need for time-consuming regeneration processes, which can lead to reduced inspection accuracy and efficiency.
Innovation Solution
A probe position inspection apparatus utilizing a transparent plate, camera, and pressure passive member, where the camera captures images of the transparent plate with probes pressed against it, and an image processor detects the probe position, eliminating the need for probe mark transfer members and deformable body regeneration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If image processing measurement by camera is used for probe position measurement, then non-contact measurement is achieved, but measurement accuracy deteriorates due to disturbance factors such as background, distance, individual focusing and deposits
Solution Approach 1:
A transparent plate is introduced as an intermediary medium between the probe and the camera. The plate provides a uniform, disturbance-free background that enables accurate image processing measurement while maintaining non-contact capability. The plate's transparency allows the camera to capture clear images of the probe tip position without the disturbances present in direct background measurement.
Solution Approach 2:
The transparent plate creates a simplified optical copy or representation of the probe position by providing a uniform background that enhances contrast. This copying approach transforms the complex measurement environment into a simplified optical scene that can be accurately captured and processed by the camera system.
2Object-affected harmful factors
If probes are made longer to increase distance from probe card main body, then discharge phenomenon is suppressed, but misalignment of probe contact portions increases
Solution Approach 1:
The invention replaces mechanical alignment verification methods with optical measurement using camera and image processing. This substitution enables precise measurement of probe positions and alignment without requiring mechanical adjustments, allowing long probes to maintain both discharge suppression and alignment accuracy through optical detection rather than mechanical control.
3Measurement precision
If deformable body regeneration process is implemented for probe inspection, then probe position can be measured, but inspection time increases and apparatus complexity increases
Solution Approach 1:
The transparent plate provides a permanent, reusable optical reference background that can be imaged repeatedly without regeneration. This replaces the deformable body that requires regeneration after each measurement, significantly reducing inspection time while maintaining measurement capability through continuous use of the same optical reference.
Solution Approach 2:
The transparent plate serves multiple functions: it provides a uniform background for image processing, maintains mechanical stability, and can be reused indefinitely without regeneration. This multi-functionality eliminates the need for separate regeneration processes and simplifies the overall apparatus compared to deformable body systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables accurate and efficient detection of probe positions, improving inspection accuracy and reducing the time required for each inspection, while being easily integratable with conventional semiconductor device inspection apparatuses.
Implementation Method 1
a camera (20) for taking an image of one surface of the transparent plate (17)
Implementation Method 2
the tip of the probe (10) for use in evaluation of a semiconductor device is pressed against the other surface of the transparent plate (17), with the pressure passive member (25) therebetween
Data Source
AI summary
A probe position inspection apparatus capable of inspecting the position of contact portions of respective probe tips easily and accurately, an apparatus for inspecting a semiconductor device, and a method of inspecting a semiconductor device are provided. The probe position inspection apparatus includes a transparent plate, a camera for taking an image of one surface of the transparent plate, and a pressure passive member covering the other surface of the transparent plate. The tip of a probe for use in evaluation of a semiconductor device is pressed against the other surface of the transparent plate, with the pressure passive member therebetween. The probe position inspection apparatus further includes an image processor for processing the image taken by the camera to detect the position of the probe in the plane of the transparent plate.