Probe Tip Defect Extraction for Substrate Signal Isolation
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Solution Overview
Problem
Current defect analysis tools, such as TEM and EDX, face challenges in detecting and analyzing small defects in semiconductor substrates and masks due to difficulties with very small defects and handling background signals, often requiring destructive sample preparation.
Innovation Solution
An analytical tool and method using an electromagnetic radiation source, probe tip, and detector system that allows for non-destructive characterization of defects by detaching them from the substrate, minimizing interference from the substrate, and performing chemical analysis using electromagnetic radiation beams like electron or ion beams.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional tools like TEM or EDX are used for defect analysis, then chemical composition information can be obtained, but the substrate creates significant background signals that interfere with detecting small defects
Solution Approach 1:
The patent extracts the defect from the substrate by using a probe tip to pick up the defect particle separately. This allows the defect to be analyzed independently without the substrate present, eliminating the background signal interference that plagues traditional TEM and EDX analysis methods.
Solution Approach 2:
The analysis process is segmented into two distinct parts: first locating the defect on the substrate, then picking it up with a probe tip for separate analysis. This segmentation isolates the defect from the substrate, enabling precise chemical composition analysis without substrate interference.
2Measurement precision
If traditional defect analysis tools are used, then defect location can be identified, but sample preparation is difficult and often requires destroying the item to be analyzed
Solution Approach 1:
The probe tip serves multiple functions: it locates the defect, picks it up, transports it, and positions it for analysis. This self-service capability eliminates the need for complex sample preparation and destructive procedures, as the defect is manipulated and analyzed in its original state on the substrate.
Solution Approach 2:
The probe tip acts as an intermediary between the substrate and the analysis tools. It picks up the defect and brings it to the analysis region, serving as a mediator that enables non-destructive analysis without requiring complex sample preparation or destruction of the original item.
3Productivity
If smaller geometry sizes are used in IC fabrication, then production efficiency increases and costs decrease, but detecting and analyzing smaller defects becomes more difficult
Solution Approach 1:
The patent replaces traditional mechanical/optical detection methods with a probe-based system that can physically interact with and pick up ultra-small defects. This mechanical substitution enables the detection and analysis of defects at scales that would be extremely difficult to detect using conventional optical or electron microscopy methods alone.
Solution Approach 2:
The probe tip serves as an intermediary that can physically grasp and manipulate defects at the smallest scales. This intermediary approach allows for the handling and analysis of ultra-small defects that correspond to the smallest geometry sizes in advanced IC fabrication, maintaining detection capability as scaling progresses.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quicker and more accurate defect analysis by isolating defects for analysis, reducing interference from the substrate and allowing for precise chemical characterization of defects, thereby identifying their source effectively.
Implementation Method 1
an electromagnetic radiation source configured to generate an electromagnetic radiation beam; a detector configured to receive a electromagnetic radiation signal generated from an interaction between the electromagnetic radiation beam and the sample
Data Source
AI summary
The apparatus includes a probe tip configured to scan a substrate having a defect to attach the defect on the probe tip while scanning the substrate, a cantilever configured to integrate a holder holding at least one probe tip, a stage configured to secure the substrate, an electromagnetic radiation source configured to generate the electromagnetic radiation beam, and an electromagnetic radiation detector configured to receive the first electromagnetic radiation signal and the second electromagnetic radiation signal. A first electromagnetic radiation signal is generated while an electromagnetic radiation beam focuses on the probe tip. A second electromagnetic radiation signal is generated while the electromagnetic radiation beam focuses on the sample attached on the probe tip. A chemical analysis of the sample is executed by comparing a difference between the first electromagnetic radiation signal and the second electromagnetic radiation signal.