Process Chamber Gas Line Insulation for Stable Heated Gas Delivery
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Solution Overview
Problem
In semiconductor process chambers, the heating jackets used to maintain reaction gas temperature lead to increased external temperatures, affecting electronic devices and reducing thermal efficiency due to heat loss.
Innovation Solution
A semiconductor process chamber design incorporating a heating jacket cover with a heat reflection coating layer and an air pocket layer to prevent heat escape and maintain thermal efficiency, including a gas line cover made of an aluminum block to distribute heat uniformly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heating jacket is used to maintain reaction gas temperature, then the gas temperature is maintained at an appropriate level, but the external temperature of the gas line and heating jacket increases, affecting electronic devices and reducing thermal efficiency
Solution Approach 1:
An insulating layer is introduced as an intermediary between the heating jacket and the external environment. This insulating layer acts as a mediator that blocks heat transfer to the surroundings, allowing the heating jacket to maintain reaction gas temperature while preventing external temperature increase and heat loss.
Solution Approach 2:
The thermal insulation structure changes the thermal parameters of the gas line system by reducing heat conductivity to the external environment. This parameter change allows the system to maintain internal temperature while minimizing external heat loss, thereby improving thermal efficiency.
2Temperature
If a heating jacket is used to maintain reaction gas temperature, then the gas temperature is maintained at an appropriate level, but the external temperature of the gas line and heating jacket increases, affecting electronic devices placed around the gas line
Solution Approach 1:
The insulating layer serves as a protective intermediary between the heating jacket and external electronic devices. It blocks the harmful thermal radiation and conduction, allowing the heating jacket to maintain reaction gas temperature without adversely affecting surrounding electronic components.
Solution Approach 2:
By changing the thermal insulation parameters of the gas line system, the external surface temperature is reduced to a safe level that does not affect electronic devices, while the internal reaction gas temperature is maintained at the required level for the process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents external temperature increases, enhances thermal efficiency, and improves the reliability of electronic equipment by ensuring uniform heating and reducing heat loss.
Implementation Method 1
the first layer may include a heat reflection coating layer
Implementation Method 2
the second layer may include an air pocket layer
Data Source
AI summary
Provided is a semiconductor process chamber including a chamber configured to accommodate a wafer, and a shower head on an upper side of the chamber and including a plurality of nozzles, wherein the shower head includes a gas supplier configured to supply gas to the shower head, and wherein the gas supplier includes a gas line, a heating jacket adjacent to the gas line, and a heating jacket cover adjacent to the heating jacket.