Process Kit Flow Guide for Deposition Uniformity and Chamber Cleaning
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Solution Overview
Problem
Existing semiconductor processing technologies face challenges in adjusting process parameters such as gas flow rates and pressures for deposition uniformity, especially at low rotation speeds, high pressures, and low flow rates, and in effectively cleaning processing chamber components.
Innovation Solution
The introduction of a process kit for semiconductor processing chambers, which includes a plate supported by a liner with annular sections and ledges, allows for the division of the processing volume into lower and upper portions. This configuration facilitates the adjustment of process gases and cleaning gases, enabling improved deposition uniformity and chamber cleaning, even under challenging conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If gas flow rates and pressures are adjusted for deposition uniformity, then deposition uniformity is improved, but device complexity increases
Solution Approach 1:
The processing chamber is divided into an upper portion and a lower portion by a plate supported on a liner with ledges. This segmentation allows independent control of process gases in each region, enabling deposition uniformity adjustment without requiring complex overall system modifications.
Solution Approach 2:
A flow guide is introduced as an intermediary component between the process gases and the substrate. The flow guide directs and controls gas flow patterns, achieving deposition uniformity through this intermediate structure rather than through complex direct control of all chamber parameters.
2Manufacturing precision
If substrate rotation is used to improve deposition uniformity, then deposition uniformity is improved, but ease of operation worsens due to adjustment difficulties at low rotation speeds
Solution Approach 1:
The need for substrate rotation is extracted and replaced by a stationary plate-flow guide system. The rotation function is taken out of the substrate support and implemented instead through the flow guide structure, eliminating the operational complexity of controlling low-speed rotation while maintaining deposition uniformity.
3Ease of manufacture
If cleaning is performed at high pressures, then cleaning effectiveness is improved, but ease of operation worsens due to adjustment difficulties
Solution Approach 1:
The cleaning process is segmented into two distinct pressure zones: high pressure in the upper portion for effective cleaning, and low pressure in the lower portion for ease of operation. The plate and liner structure enables this segmentation, allowing independent pressure control in each region.
4Manufacturing precision
If low flow rates are used for process gases, then deposition precision is improved, but ease of operation worsens due to adjustment difficulties
Solution Approach 1:
Different flow rate characteristics are applied to different regions: the upper portion maintains low flow rates for high deposition precision, while the lower portion can operate at higher flow rates for ease of operation. The flow guide and plate structure enable this local differentiation of gas flow properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The process kit enhances deposition uniformity and chamber cleanliness by allowing for precise control of gas flows and pressures, mitigating the effects of substrate rotation, and enabling effective cleaning of chamber components, thus improving overall semiconductor processing efficiency.
Implementation Method 1
a plurality of lamps and a substrate support disposed in the internal volume
Implementation Method 2
flowing one or more process gases over the substrate to form one or more layers on the substrate
Data Source
AI summary
The present disclosure relates to flow guides, process kits, and related methods for processing chambers to facilitate deposition process adjustability. In one implementation, a process kit for disposition in a processing chamber applicable for use in semiconductor manufacturing includes a plate having a first face and a second face opposing the first face. The process kit includes a liner. The liner includes an annular section, and one or more ledges extending inwardly relative to the annular section. The one or more ledges are configured to support one or more outer regions of the second face of the plate. The liner includes one or more inlet openings extending to an inner surface of the annular section on a first side of the liner, and one or more outlet openings extending to the inner surface of the annular section on a second side of the liner.