Processing liquid temperature control apparatus
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing processing liquid temperature control apparatuses are bulky and costly due to multiple components, and they require improvement in heat exchange efficiency between the processing liquid and the temperature adjustment portion.
Innovation Solution
A compact processing liquid temperature control apparatus is designed with a block body made of a silicon carbide sintered body, featuring an integral structure with a flow path and partition walls, where the temperature adjustment is directly performed via Peltier modules laminated on the block body's surface, eliminating the need for additional corrosion-resistant and heat exchanger plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple components (corrosion-resistant plate, heat exchanger plate) are used between the block body and temperature adjustment portion, then the apparatus provides adequate heat exchange and corrosion resistance, but the number of parts increases leading to larger size and higher cost
Solution Approach 1:
The patent merges the block body, corrosion-resistant plate, and heat exchanger plate into a single integrated block body made of silicon carbide sintered material. This consolidation eliminates the need for separate corrosion-resistant and heat exchanger plates, reducing the number of parts while maintaining both corrosion resistance and heat exchange functionality through the inherent properties of silicon carbide
Solution Approach 2:
The patent employs silicon carbide sintered material as a composite material that simultaneously provides corrosion resistance and thermal conductivity. This composite material replaces the need for multiple separate components (corrosion-resistant plate + heat exchanger plate) by integrating both functions into a single material system
2Reliability
If multiple components (corrosion-resistant plate, heat exchanger plate) are used between the block body and temperature adjustment portion, then the apparatus provides adequate heat exchange, but the thickness of intermediate layers reduces heat exchange efficiency
Solution Approach 1:
The patent merges the block body and heat exchanger plate into a single integrated structure, eliminating the intermediate heat exchanger plate that previously reduced heat exchange efficiency. This direct integration allows the temperature adjustment portion to exchange heat more efficiently with the processing liquid through the partition wall
3Reliability
If multiple components are laminated on the block body surface, then the apparatus provides necessary functional layers, but the overall apparatus size increases
Solution Approach 1:
The patent merges multiple functional layers (block body, corrosion-resistant plate, heat exchanger plate) into a single integrated block body. This consolidation significantly reduces the overall apparatus size by eliminating the need for stacked layers, while maintaining all necessary functional properties through the silicon carbide sintered material
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the number of parts, lowers costs, and enhances heat exchange efficiency by minimizing the thickness of partition walls, making the apparatus more compact and responsive to temperature changes.
Implementation Method 1
a temperature adjustment portion provided on an outer surface of the block body to exchange heat with the semiconductor processing liquid via the partition wall
Implementation Method 2
a Peltier module as a temperature adjustment portion
Data Source
AI summary
A processing liquid temperature control apparatus includes a block body with an integral structure made of a silicon carbide sintered body, the block body having a flow path through which a semiconductor processing liquid flows, and a temperature adjustment portion provided at the block body to adjust a temperature of the semiconductor processing liquid flowing through the flow path. Accordingly, it is possible to reduce the number of parts and achieve compactness and cost reduction. In addition, it is possible to enhance heat conduction between the processing liquid and the temperature adjustment portion, and improve heat exchange efficiency.