Programmable Chip Pin Configuration Without Wire Bonding Limits

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Solution Overview

Problem

Conventional methods for changing pin functions in IC packaging are inflexible and costly, as they require wire bonding, which fixes pin functions once the IC is packaged, limiting the ability to change configurations without modifying the chip circuitry and resulting in high manufacturing costs and low yield due to long bonding distances.

Innovation Solution

An apparatus with an input pin receiving unit, an output pin control unit, and a signal control unit that allows users to dynamically reconfigure pin functions using a program, enabling the selection and reassignment of pin functions without altering the chip circuitry, applicable to both input and output pins.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If wire bonding is used to deploy pin functions, then pin functions can be deployed without changing chip circuitry, but the method lacks flexibility and has high cost

Engineering Contradiction:

Improveease of pin function deploymentVSAvoidflexibility of pin function configuration

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent implements dynamic pin function configuration through a control unit that can programmatically assign different functions to pins based on operational modes. The pin function assignment is no longer fixed but can be dynamically changed via control signals, allowing the same physical pin to serve different logical functions depending on the configured mode, thereby achieving flexibility without wire bonding

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent makes pins multi-functional by enabling each pin to serve multiple different functions through software control. The control unit receives mode selection signals and dynamically configures pin functions accordingly, allowing a single pin to perform various roles (input, output, control, status) depending on the operational mode, eliminating the need for dedicated wires for each function

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Ease of manufacture

If wire bonding is used to deploy pin functions, then pin functions can be deployed, but the cost of bonding machine is high

Engineering Contradiction:

Improveease of pin function deploymentVSAvoidcost of bonding machine

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical wire bonding system with a software-based control system. Instead of using physical bonding machines to connect wires to pins, the invention uses a control unit that receives mode selection signals and programmatically configures pin functions through electronic control, eliminating the need for expensive bonding equipment

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent creates a virtual representation of pin function assignments through software code rather than physical wire connections. The control unit stores and executes configuration data that defines pin functions for different modes, allowing the system to replicate various wiring configurations through software without requiring physical re-wiring or bonding

Inventive Principle:

Principle #26Copying

3Ease of manufacture

If wire bonding is used to deploy pin functions, then pin functions can be deployed, but yield is low when bonding distance is too long

Engineering Contradiction:

Improveease of pin function deploymentVSAvoidyield of bonding process

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent replaces the mechanical wire bonding process with an electronic control system that configures pin functions through software. This eliminates the physical bonding process entirely, removing the reliability issues associated with long bonding distances and bonding yield

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

4Ease of manufacture

If pins are fixedly bonded with IC circuitry, then pin functions are deployed, but pin functions can no longer be changed when IC is completely packaged

Engineering Contradiction:

Improveease of pin function deploymentVSAvoidability to change pin functions

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent pre-configures multiple pin function assignments for different operational modes within the control unit before the IC is fully packaged and operational. This preliminary configuration of multiple possible pin function assignments allows the system to adapt to different packaging scenarios and operational requirements without requiring physical reconfiguration or re-packaging

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS7612581B2Apparatus for dynamic deployment of pin functions on a chip

Publication Date: 2009.11.03 HOLTEK SEMICON INC

AI summary

An apparatus for dynamic deployment of pin functions on a chip is disclosed in the present invention. The apparatus comprises: an input pin receiving unit, capable of integrating a plurality of pins and selecting pin functions according to a program; an output pin control unit, capable of issuing a control signal to the plurality of pins; and a signal control unit, controlled by the program and coupled to the input pin receiving unit and the output pin control unit so as to communicate therebetween; wherein the pin functions are designated by the user to select an output signal for each of the plurality of pins according to the program.