Semiconductor Die with Programmable Duplicate Bond Pads for Package Flexibility
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Solution Overview
Problem
Memory device packages face challenges in cost management due to the higher manufacturing expense of support substrates in Ball Grid Array (BGA) configurations, which are more expensive than lead frames in Small Outline Integrated Circuit (SOIC) packages, necessitating a solution that can accommodate different packaging types without increasing costs.
Innovation Solution
The implementation of semiconductor devices with duplicate die bond pads that can be programmed into different pad states, allowing for either first or second pad states to be enabled, which simplifies manufacturing and reduces costs by allowing the same memory die to be used in both BGA and SOIC packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If BGA package configuration is used, then footprint is reduced and routing is simplified, but manufacturing cost increases due to expensive support substrates
Solution Approach 1:
The memory die is designed with duplicate sets of bond pads (first set and second set) that can serve different packaging configurations. The same die can be programmed to enable either the first bond pads for BGA packaging or the second bond pads for SOIC packaging, making the die universal for multiple package types and reducing the need for different die designs.
Solution Approach 2:
The bond pads are configured to be selectively enabled or disabled through programming. A first state enables the first set of bond pads while disabling the second set, and a second state enables the second set while disabling the first set. This dynamic switching capability allows the same physical die to adapt to different packaging requirements.
2Adaptability or versatility
If multiple die designs are created for different packaging types, then packaging-specific optimization is achieved, but device complexity and manufacturing variety increase
Solution Approach 1:
Instead of creating separate die designs for BGA and SOIC packages, the invention uses a single universal die design with duplicate bond pads that can be programmed for different configurations. This reduces die design variety while maintaining compatibility with multiple packaging types.
Solution Approach 2:
The bond pad functionality is segmented into two separate sets (first set and second set) that can be independently enabled or disabled. This segmentation allows selective activation of appropriate bond pads based on the target packaging type, enabling one die design to serve multiple purposes.
Data Source
AI summary
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.