Programmable Electrolytic Mask for Reconfigurable Lithography Patterns
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Solution Overview
Problem
Existing masks in lithography technology are costly, difficult to alter, and prone to defects, leading to increased production costs and complexity, especially in small-batch chip production, and current direct writing methods have low yield and high costs.
Innovation Solution
A mask with an electrolytic reaction layer and control circuit layers that allow for programmable control of light-transmitting states by controlling the deposition and dissolution of metal elements, enabling pattern alteration and reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a traditional mask is prepared, then the pattern structure can be formed for lithography, but the pattern cannot be easily altered and defects are difficult to repair
Solution Approach 1:
The mask employs an electrolytic reaction layer that can dynamically change its light-transmitting state through electrochemical reactions. By applying control voltages, metal elements in the electrolytic layer can be deposited or dissolved, enabling the mask pattern to be dynamically altered and reconfigured for different lithography applications.
Solution Approach 2:
The mask utilizes changes in the physical and chemical parameters of the electrolytic reaction layer to achieve pattern modification. The light-transmitting state is controlled by changing the deposition amount of metal through electrochemical reactions, allowing the same mask structure to produce different patterns by adjusting electrochemical parameters.
2Reliability
If a traditional mask is used, then lithography can be performed, but the mask has high cost and is difficult to repair
Solution Approach 1:
The mask design allows for the recovery and reuse of the expensive mask structure. When defects occur or pattern changes are needed, the electrolytic reaction layer can be reconfigured or repaired electrochemically without replacing the entire mask, thereby extending mask life and reducing manufacturing costs.
Solution Approach 2:
The patent replaces mechanical/physical mask modification methods with electrochemical control. Instead of physically altering or repairing mask structures, the invention uses electrochemical reactions to deposit or dissolve metal in the electrolytic layer, enabling non-contact, precise, and reversible pattern changes.
3Productivity
If direct writing methods are used for small-batch production, then flexibility is improved, but yield is low and cost is high
Solution Approach 1:
The mask serves multiple functions: it can be used for high-volume production with pattern change capabilities and for small-batch production with high flexibility. The same mask structure supports both mass production requirements and customized production needs, eliminating the need for separate direct writing equipment and improving overall productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables cost-effective, reusable, and programmable lithography masks that reduce production costs and improve yield, facilitating small-batch chip production and high integration.
Implementation Method 1
a light-transmitting state of a pixel region in the mask is configured to be decided by a control voltage between at least a part of the first control electrode and at least a part of the second control electrode contained in the pixel region, and the control voltage controls the light-transmitting state of the pixel region by controlling a deposition amount of metal in the electrolytic reaction layer
Implementation Method 2
an electrolytic reaction layer in which metal element is configured to be in a deposited-metal state or a dissolved-ion state
Data Source
AI summary
A mask, a lithographing apparatus, and a method for manufacturing a mask, wherein the mask includes: an electrolytic reaction layer (110) in which metal element is configured to be in a deposited-metal state or a dissolved-ion state; a first control circuit layer (120) provided on a first side of the electrolytic reaction layer (110) and including a plurality of first control electrodes (121); and a second control circuit layer (130) provided on a second side of the electrolytic reaction layer (110) that is opposite to the first side and including a plurality of second control electrodes (131), wherein a light-transmitting state of a pixel region in the mask is configured to be decided by a control voltage between at least a part of the first control electrode (121) and at least a part of the second control electrode (131) contained in the pixel region, and the control voltage controls the light-transmitting state of the pixel region by controlling a deposition amount of metal in the electrolytic reaction layer (110).