Programmable Magnetic Tunnel Junction Temperature Sensor

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Solution Overview

Problem

Conventional on-chip temperature sensors are not sensitive enough to temperature changes and require complex manufacturing processes, occupying valuable space on semiconductor chips.

Innovation Solution

A programmable magnetic tunnel junction structure in a Wheatstone bridge configuration, utilizing MRAM-like materials, is connected in series with a resistor material to enhance temperature sensitivity, featuring a stack of MRAM-like MTJ materials with a free layer and reference layer separated by a barrier layer, allowing magnetization rotation in response to signals or magnetic fields, and fabricated using integrated circuit technology.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional on-chip temperature sensors (resistors, MIM structures, MOSFETs) are used, then the manufacturing process is complex and they occupy valuable chip area, but they provide insufficient temperature sensitivity

Engineering Contradiction:
Improvetemperature sensitivityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent changes the fundamental operating principle from conventional resistor-based temperature sensing to magnetic tunnel junction-based sensing. The MTJ structure utilizes spin-dependent tunneling current that is highly sensitive to temperature-induced changes in magnetic anisotropy and resistance, achieving 2-4 times greater temperature sensitivity while using standard CMOS-compatible fabrication processes

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite structure combining magnetic tunnel junction materials (ferromagnetic layers, tunnel barrier, antiferromagnetic layers) with CMOS circuitry. This composite approach integrates the high temperature sensitivity of MTJ materials with the manufacturing capabilities of CMOS platforms, resolving the contradiction between sensitivity and manufacturing complexity

Inventive Principle:
Principle #40Composite materials

2Measurement precision

If conventional on-chip temperature sensors are used, then the manufacturing process is simple, but they occupy valuable real estate on the chip

Engineering Contradiction:
Improvetemperature sensitivityVSAvoidchip area occupation
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent transitions from planar resistor-based temperature sensors to vertically stacked magnetic tunnel junction structures. The MTJ stack extends in the vertical dimension with multiple thin films (ferromagnetic layers, oxide barriers, antiferromagnetic layers), achieving high temperature sensitivity in a compact footprint that occupies minimal chip real estate

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Measurement precision

If MTJ structures are used, then temperature sensitivity is enhanced 2-4 times, but the device complexity increases

Engineering Contradiction:
Improvetemperature sensitivityVSAvoidfabrication complexity
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The patent designs the magnetic tunnel junction structure to serve multiple functions: temperature sensing, magnetic field sensing, and non-volatile memory storage. This multi-functionality justifies the increased fabrication complexity by providing additional capabilities beyond simple temperature measurement, making the enhanced device worthwhile

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides higher sensitivity to temperature changes with a smaller footprint compared to CMOS resistor-based designs, achieving thermal sensitivity approximately 2-4 times greater than conventional CMOS resistor-based temperature sensors.

Implementation Method 1

a programmable magnetic tunnel junction structure, utilizing MRAM-like materials, is connected in series with a resistor material to enhance temperature sensitivity

Methodology Applied
Scientific EffectMagnetoresistance: Magnetoresistance

Implementation Method 2

a stack of MRAM-like MTJ materials with a free layer and reference layer separated by a barrier layer

Methodology Applied
Scientific EffectTunneling:

Data Source

PatentUS12156476B2Programmable magnetic tunnel junction
Publication Date: 2024.11.26 GLOBALFOUNDRIES SINGAPORE PTE LTD
  • US12156476B2 patent drawing
  • US12156476B2 patent drawing
  • US12156476B2 patent drawing

AI summary

The present disclosure relates to semiconductor structures and, more particularly, to temperature sensors with programmable magnetic tunnel junction structures and methods of manufacture. A structure includes a resistor material connected in series with a programmable magnetic tunnel junction structure in a Wheatstone bridge configuration.