Programmable Thrust-Up Blocks for Thin Die Separation
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Solution Overview
Problem
The rigidity of thin semiconductor dies is compromised by the tackiness force of dicing tape, requiring reduced stress during separation, and existing thrust-up methods are inflexible in adapting to changes in die thickness or tape type.
Innovation Solution
A semiconductor manufacturing apparatus with a thrust-up unit featuring independently operable blocks and a control section that configures thrust-up sequences based on a time chart recipe, allowing for customizable height and speed settings for each block.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a one driving shaft pusher is used to thrust up multi stage blocks, then the structure is simple and easy to manufacture, but the thrust-up sequences and thrust-up amounts cannot be adjusted when die thickness or dicing tape type changes
Solution Approach 1:
The single driving shaft is divided into multiple independent driving shafts, each controlling a separate block. This segmentation allows each block to be thrust up independently with adjustable sequences and amounts, enabling adaptation to different die thickness and dicing tape types while maintaining reasonable structural simplicity
Solution Approach 2:
The thrust-up unit transitions from a static, fixed-sequence system to a dynamic, programmable system where the control section can adjust thrust-up sequences and amounts based on different processing conditions, achieving versatility without excessive structural complexity
2Stability of the object's composition
If mechanically constant thrust-up operation is used, then the operation is stable and easy to control, but it cannot optimize separation for thin dies with varying rigidity
Solution Approach 1:
The system enables dynamic changes in thrust-up parameters (sequences and amounts) through programmable control, allowing optimization for thin dies with varying rigidity while maintaining operational stability through controlled execution of predefined recipes
3Strength
If stress is reduced to pick up thin dies, then die damage is minimized, but separation efficiency may be compromised
Solution Approach 1:
The thrust-up force is segmented and applied progressively through multiple blocks in controlled sequences, distributing the separation stress over time and space to minimize peak stress on thin dies while maintaining effective separation efficiency
Solution Approach 2:
The thrust-up process becomes dynamic and adaptive, adjusting the sequence and amount of thrust applied to each block based on die characteristics, thereby optimizing the balance between minimizing stress on thin dies and maintaining separation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible and optimized thrust-up sequences for thin dies, reducing stress and improving separation efficiency by adapting to varying conditions.
Implementation Method 1
a head having a collet absorbing the die
Data Source
AI summary
A semiconductor manufacturing apparatus includes a thrust-up unit having a plurality of blocks in contact with a dicing tape, a head having a collet absorbing the die and capable of being moved up and down, and a control section controlling the operation of the thrust-up unit and the head. The thrust-up unit can operate each of the plurality of blocks independently. The control section configures the thrust-up sequences of the plurality of blocks in a plurality of steps, and controls the operation of the plurality of blocks on the basis of a time chart recipe capable of setting the height and the speed of the plurality of blocks for each block and in each step.