Optical Projector Module Thermal Lens Compensation

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Solution Overview

Problem

Optical projector modules face heat-related distortion issues due to the heat generated by light emitting elements, which affects the quality of the light beam emitted.

Innovation Solution

The implementation of a ceramic printed circuit board with a metal strengthening board and thermal conductivity gel, along with a supporting member featuring a heat dissipating region and conducting region, effectively dissipates heat and maintains the structural integrity and optical power monitoring, preventing beam distortion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a light emitting element is used to generate light, then illumination intensity is improved, but heat is generated causing beam distortion

Engineering Contradiction:
Improvelight outputVSAvoidbeam distortion
Core Design Contradiction:
Illumination intensityVSObject-affected harmful factors

Solution Approach 1:

The patent applies thermal lensing compensation by utilizing the heat generated by the light emitting element to create a controlled thermal lens effect in a compensation lens. This thermal lens is designed to counteract the negative thermal lensing that occurs in the projection lens due to heat absorption, thereby converting the harmful heat into a beneficial compensatory mechanism that prevents beam distortion

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent introduces a thermal lens compensation mechanism as an intermediary element between the light emitting element and the projection lens. This compensation lens acts as a mediator that counterbalances the thermal effects, allowing the light beam to maintain its integrity despite the heat generated by the high-power light emitting element

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If high power light emitting element is used, then productivity is improved, but heat generation increases causing structural degradation

Engineering Contradiction:
Improvelight outputVSAvoidstructural integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent converts the harmful thermal effects into a beneficial compensatory mechanism by designing a thermal lens compensation system. The heat from high-power light emitting elements is used to create a controlled thermal lens that counteracts negative thermal lensing in the projection system, enabling sustained high-power operation without structural degradation

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent employs parameter changes by adjusting the thermal lens power of the compensation lens to match and counteract the thermal lensing in the projection lens. This dynamic parameter adjustment allows the system to maintain optimal performance across varying operating conditions and power levels

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively dissipates heat from the light emitting element, preventing distortion and ensuring reliable operation by maintaining the structural integrity and monitoring optical power, thereby enhancing the projector's performance and reliability.

Implementation Method 1

a ceramic printed circuit board with a metal strengthening board and thermal conductivity gel

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10754232B2Optical projector module
Publication Date: 2020.08.25 TRIPLE WIN TECH (SHENZHEN) CO LTD
  • US10754232B2 patent drawing
  • US10754232B2 patent drawing
  • US10754232B2 patent drawing

AI summary

An optical projector module proofed against distortion caused by heat building up in and around the light-emitting element includes a printed circuit board (PCB), a light emitting element, and an optical structure. The optical structure on the PCB includes a supporting member almost completely enclosing the light emitting element. The supporting member includes an embedded metal heat dissipating layer extending to cover outside surfaces of the supporting member. The metal heat dissipating layer occupies more than 70% of the outside surfaces of the supporting member, and being metallic the dissipating layer is able to conduct electricity.