Protected Electrode Array Interposer for Corrosion-Resistant ECAM
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Solution Overview
Problem
Metal additive manufacturing is limited by high costs associated with selective laser melting and electron beam melting systems, and conventional techniques produce parts with rough surface finishes due to unmelted metal powder, while electrochemical-additive manufacturing (ECAM) offers new options but faces challenges in protecting electrode arrays from corrosive environments.
Innovation Solution
The development of protected electrode arrays comprising an interposer base made from materials like silicon or glass, with vias aligned with electrode connectors, and interposer electrodes deposited within these vias, which are electrically and mechanically coupled to the connectors, and bonded to an electrode-interface circuit using an adhesive layer, with passivation layers to prevent corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional additive manufacturing techniques (selective laser melting, electron beam melting) are used, then metal parts can be manufactured, but the cost is high and surface finish is rough
Solution Approach 1:
The patent replaces thermal-based additive manufacturing (laser melting, electron beam melting) with electrochemical deposition. Instead of using high-energy beams to melt and fuse metal powder, the invention uses electrochemical reactions to deposit metal layers, eliminating the need for expensive laser systems and electron beam equipment while achieving superior surface finish without requiring post-processing removal of unmelted powder
Solution Approach 2:
The invention changes the fundamental process parameters from thermal-mechanical (melting temperature, laser power) to electrochemical (current density, voltage, electrolyte composition). This parameter transformation enables cost-effective manufacturing while achieving precise control over deposition rates and surface quality, directly addressing both the cost and surface finish issues
2Ease of manufacture
If electrochemical-additive manufacturing is used, then cost-effective manufacturing is achieved, but electrode arrays are vulnerable to corrosion in the manufacturing environment
Solution Approach 1:
The patent applies preliminary protective actions by coating electrode array components (substrate, electrodes, circuitry) with corrosion-resistant materials before they are exposed to the electrolyte environment during ECAM operation. This pre-protection ensures that the components can withstand the corrosive manufacturing environment throughout their service life, resolving the reliability issue while maintaining the cost-effectiveness of ECAM
Solution Approach 2:
The invention employs disposable or easily replaceable protective coatings on electrode array components. These coatings provide corrosion protection during the manufacturing process and can be renewed or replaced if needed, ensuring long-term reliability without requiring expensive, complex protective systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the durability and performance of electrode arrays in ECAM systems by protecting them from corrosive environments, improving surface finish quality and reducing operational costs by using more cost-effective materials and processes.
Implementation Method 1
bonding the interposer base to an electrode interface circuit using an adhesive layer
Implementation Method 2
a plasma etch step of directing plasma to the interposer base thereby creating a trench
Implementation Method 3
a deposition step of depositing a chemically inert passivation layer on the side walls and the bottom of the trench
Implementation Method 4
depositing interposer electrodes at least partially within the vias in the interposer base thereby forming the interposer
Data Source
AI summary
Described herein are protected electrode arrays and methods of fabricating thereof. Such electrode arrays can be used in electrochemical-additive manufacturing (ECAM) systems and other systems/applications. In some examples, a protected electrode array comprises an electrode-interface circuit and an interposer bonded to the circuit, e.g., using an adhesive layer. The interposer can include an interposer base formed from silicon, glass, and other like materials suitable for operating environments. The interposer base comprises vias, which are aligned with the circuit's electrode connectors, and interposer electrodes deposited within these vias and electrically coupled to the electrode connectors. In some examples, the interposer comprises a base cover and/or electrode covers positioned over the interposer base and the interposer electrodes, respectively. The interposer can be bonded to the electrode-interface circuit before forming the vias, after forming the vias but before depositing the interposer electrodes, or after depositing the interposer electrodes within the vias.