Protective Layer for Selective ALD Encapsulation of OLED Contact Sections
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Solution Overview
Problem
Conventional methods for encapsulating optoelectronic components, such as OLEDs, often require costly and inconvenient processes like scraping or laser ablation to expose contact regions, which can damage thin metal electrodes and are unsuitable for component architectures with challenging ALD layer removal, especially when metal contacts are applied by thermal vapor deposition.
Innovation Solution
A process involving the formation of a protective layer using self-assembled monolayers (SAMs) that repel encapsulation materials, allowing selective avoidance of encapsulation on contact regions during ALD coating, thereby eliminating the need for subsequent removal steps and preventing damage to the electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire optoelectronic component is coated with an encapsulation layer by ALD process, then the optically functional layers and electrodes are protected from environmental influences, but the contact regions are also coated requiring costly and inconvenient removal processes
Solution Approach 1:
The contact regions are segmented from the rest of the component by applying masking layers selectively only to the contact regions before the ALD encapsulation process. This allows the encapsulation layer to be formed on the functional areas while contact regions remain accessible without requiring post-processing removal.
Solution Approach 2:
The masking layers are applied preliminarily to the contact regions before the encapsulation layer formation. This preliminary action prevents the encapsulation material from depositing on contact regions in the first place, eliminating the need for costly and inconvenient removal processes like scraping or laser ablation.
2Ease of manufacture
If scraping or laser ablation is used to expose contact regions, then the encapsulation layer can be removed, but the thin metal electrodes can be damaged
Solution Approach 1:
The masking layers are applied preliminarily to protect contact regions before encapsulation layer formation. This prevents the need for any post-encapsulation removal processes that could damage the thin metal electrodes, thereby maintaining electrode integrity throughout the manufacturing process.
Solution Approach 2:
The masking layers, which initially seem to add complexity, actually eliminate the harmful effects of scraping or laser ablation. By converting the protective function to the masking layer rather than relying on aggressive removal methods, the process protects both the encapsulation layer quality and the electrode integrity.
3Ease of manufacture
If laser ablation is used to remove encapsulation layer from contact regions, then the encapsulation layer can be selectively removed, but heat arises causing component damage
Solution Approach 1:
The masking layers are applied preliminarily to contact regions before the ALD encapsulation process. This preliminary protective action prevents the encapsulation material from depositing on contact regions, eliminating the need for laser ablation and avoiding all associated heat damage to the component.
Solution Approach 2:
The chemical/physical masking approach replaces the thermal-mechanical laser ablation process. Instead of using high-energy laser beams that generate harmful heat, the process uses selective masking layer deposition followed by gentle removal methods, substituting a low-energy approach for a high-energy one.
4Ease of manufacture
If conventional removal processes are used to expose contact regions, then the encapsulation layer can be removed, but the process is costly and inconvenient
Solution Approach 1:
The manufacturing process is segmented into distinct steps: selective masking layer application to contact regions, followed by ALD encapsulation of the entire component. This segmentation allows contact regions to be protected during encapsulation, eliminating the need for complex post-processing removal steps and simplifying the overall manufacturing flow.
Solution Approach 2:
The masking layer application is performed preliminarily before the main encapsulation process. This preliminary action prevents the need for costly and inconvenient removal processes later, as the contact regions remain accessible from the beginning without requiring any post-encapsulation intervention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of optoelectronic components in a simpler, more cost-effective manner with reliable operability by preventing encapsulation layer formation on contact regions, thus avoiding damage and ensuring component integrity.
Implementation Method 1
forming a protective layer by means of a self-assembled monolayer (SAM) on the contact section
Implementation Method 2
the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer
Implementation Method 3
forming the encapsulation layer by means of an ALD process
Data Source
AI summary
Various embodiments provide a process for producing an optoelectronic component. The process includes forming a first electrode and at least one contact section atop a carrier, forming an optically functional layer structure atop the first electrode, forming a second electrode atop the optically functional layer structure, the first electrode or the second electrode being electrically connected to the contact section, applying a protective layer to at least a subregion of the contact section, the protective layer being formed by a material which is repellent to a substance for production of an encapsulation layer, and forming the encapsulation layer atop the second electrode and atop the contact section, the subregion remaining free of the encapsulation layer because of the protective layer.