Protective Layer Bonding for Fine-Pitch Conductive Bumps
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Solution Overview
Problem
Conventional electronic component manufacturing methods face issues with adhesive residue on conductive bumps due to reduced spacing, leading to low manufacturing yield and inability to meet miniaturization requirements.
Innovation Solution
Incorporating a protective layer made of water-soluble adhesive that covers conductive bumps, allowing for complete coverage during bonding and subsequent removal, thereby preventing adhesive residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the distance between second conductive bumps is reduced to meet miniaturization requirements, then the compactness of electronic component is improved, but the adhesive material of the tape cannot fill between the conductive bumps, causing adhesive residue and low manufacturing yield
Solution Approach 1:
The patent introduces a protective layer as an intermediary substance between the tape adhesive and the second conductive bumps. This protective layer receives the adhesive material during bonding, preventing direct contact between the adhesive and the conductive bumps. After bonding, the protective layer is removed, taking the adhesive residue with it. This mediator approach resolves the contradiction by enabling miniaturization while maintaining manufacturing yield.
2Volume of moving object
If the distance between second conductive bumps is reduced for miniaturization, then the compactness is improved, but the tape cannot cover each conductive bump, resulting in adhesive residue
Solution Approach 1:
The protective layer serves as a mediator that intercepts the adhesive material before it can contaminate the second conductive bumps. By placing this protective layer over the conductive bumps during the bonding process, the adhesive is directed onto the protective layer instead. Subsequent removal of the protective layer eliminates any adhesive residue, thus preventing the harmful effect while maintaining miniaturization benefits.
Solution Approach 2:
The protective layer is temporarily applied during the bonding process to prevent adhesive residue, then discarded (removed) after serving its protective function. This temporary protective layer is specifically designed to be removed after bonding, taking the adhesive residue with it. The protective layer is consumed in the process of preventing contamination, which aligns with the discarding principle.
Data Source
AI summary
An electronic component and a manufacturing method thereof are provided, in which a plurality of conductive bumps are covered by a protective layer on a second side of a base material, and then a plurality of the electronic components are bonded on a tape of a carrier via the protective layer thereof, so that the protective layer made of such as water-soluble adhesive can cover each of the conductive bumps, and the protective layer can be removed in a subsequent process. Therefore, even if the distance between the conductive bumps becomes smaller with the requirement for miniaturization so that the tape of the carrier does not cover each of the conductive bumps, the conductive bumps will not have adhesive residue issue, such that the electronic component can be designed to meet miniaturization requirements.