Controlled Protective Layer Removal Using Etching Speed Differential
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Solution Overview
Problem
In the semiconductor industry, protective layers on components exposed to reactive process media degrade inhomogeneously, leading to premature component replacement and increased costs, as the existing methods for removing or extending the life of these layers can negatively impact adhesion and morphology.
Innovation Solution
A method involving a controlled removal of the protective layer using an etching or solvent medium with different etching speeds for the protective and intermediate layers, where the intermediate layer is etched more slowly, allowing for the protective layer's removal without damaging the underlying component, and enabling the application of a new protective layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If the protective layer is removed inhomogeneously under process media influence, then the service life of the protective layer is extended, but particles are released from the substrate and the protective effect decreases
Solution Approach 1:
An intermediate layer is introduced between the protective layer and the substrate. This intermediate layer serves as a mediator that allows for controlled removal of the protective layer while protecting the substrate from particle release and damage, thus maintaining the protective effect even as the protective layer degrades
Solution Approach 2:
The coating system is segmented into three distinct layers: the protective layer, the intermediate layer, and the substrate. This segmentation allows each layer to perform its specific function independently, enabling the protective layer to be removed or degraded without directly exposing the substrate to harmful effects
2Duration of action of stationary object
If a new protective layer is applied over the remainder of the existing protective layer to extend service life, then the service life is extended, but the adhesion and morphology of the protective layer are negatively influenced
Solution Approach 1:
The intermediate layer acts as a stable foundation that allows multiple protective layers to be applied and removed cyclically without degrading the underlying substrate or compromising adhesion, enabling repeated service life extensions
Solution Approach 2:
The system allows for parameter changes in the protective layer (thickness, composition) without affecting the fundamental adhesion to the substrate, as the intermediate layer provides a consistent interface that maintains morphological stability
3Duration of action of stationary object
If the total layer thickness of the protective layer is increased at points where protective layer is still present, then the service life is extended, but the adhesion and morphology are negatively influenced causing the layer to fall off
Solution Approach 1:
The intermediate layer serves as a buffer that absorbs the stress and adhesion challenges associated with varying protective layer thicknesses, allowing the protective layer to be thicker in some areas without causing delamination or morphological defects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method extends the service life of components by allowing for the controlled removal of the protective layer without damaging the component, enabling multiple reuse cycles without replacing the underlying substrate and maintaining the component's integrity.
Implementation Method 1
bringing the protective layer into contact with an etching or solvent medium; and removing the protective layer under the action of the etching or solvent medium
Implementation Method 2
the etching or solvent medium causes a first etching or dissolving speed of the protective layer and a second etching or dissolving speed of the intermediate layer
Data Source
AI summary
A method 14 for the controlled removal of a protective layer 3 from a surface of a component 10, wherein the component comprises:a base body 1; an intermediate layer 2, which at least partially covers the base body; andsaid protective layer 3, which comprises an amorphous solid, in particular an amorphous nonmetal, in particular amorphous ceramic, and at least partially covers the intermediate layer;wherein the method comprises the following steps:bringing 11 the protective layer 3 into contact with an etching or solvent medium 4; andremoving 12 the protective layer 3 under the action of the etching or solvent medium 4 until the intermediate layer 2 is exposed;and wherein the etching or solvent medium causes a first etching or dissolving speed of the protective layer and a second etching or dissolving speed of the intermediate layer and wherein the first etching or dissolving speed is greater than the second etching or dissolving speed. The invention furthermore relates to a method for replacing an old protective layer on a component, a method for operating a thin-film process facility, a component for use in a thin-film process facility, and a production method for the component.