Proximity Sensor Package Cavities for Transmitter-Receiver Isolation
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Solution Overview
Problem
Existing proximity sensors face challenges in achieving precise measurements due to inadequate channel isolation between transmitters and receivers, requiring complex calibration and large sensing system sizes, especially when trying to integrate both into a single package.
Innovation Solution
The method involves using sacrificial studs to prevent molding compound from encapsulating the transmitter and receiver, creating cavities for them, and then removing the studs to expose and isolate these components within the sensor package, ensuring channel isolation and allowing for precise alignment without increasing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the transmitter and receiver are placed in a single package to ensure fixed spatial relationship, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The invention divides the sensor package into distinct cavities - a first cavity for the transmitter and a second cavity for the receiver. These cavities are separated by a partition structure, physically segmenting the components to prevent signal interference while maintaining fixed spatial relationships for precise measurements
Solution Approach 2:
The invention extracts the transmitter and receiver into separate enclosed cavities within the package, isolating them from each other and from the external environment. This extraction prevents signal leakage and interference while maintaining the benefits of integration
2Measurement precision
If optical components are carefully aligned to achieve precise measurements, then measurement precision is improved, but the size of the sensing system increases
Solution Approach 1:
The invention merges the transmitter and receiver alignment process by establishing their positions relative to a common reference plane during the same manufacturing step. This simultaneous alignment eliminates the need for separate alignment procedures and reduces the overall space required for component mounting
3Reliability
If the transmitter and receiver are enclosed in a single package, then channel isolation is improved, but manufacturing complexity increases
Solution Approach 1:
The partition structure is formed preliminarily during the molding process before the actual sealing and assembly steps. This preliminary formation of the partition creates the channel separation structure in advance, simplifying subsequent manufacturing steps while ensuring proper channel isolation
Data Source
AI summary
A packaged integrated circuit (IC), comprising: a lead frame; one or more semiconductor dies on the lead frame, the one or more semiconductor dies including a first circuit and a second circuit; and a molding compound encapsulating the lead frame and the semiconductor die, the molding compound including a first cavity over the first circuit and a second cavity over the second circuit, in which at least one of the first or second cavities includes a second material different from the molding compound.