Physical Vapor Deposition EMI Shielding for Electronic Packages
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Solution Overview
Problem
Current EMI shielding methods for electronics packages, such as sputtering and laser trenching, are costly, time-consuming, and inefficient, leading to increased footprint and complexity in manufacturing, while also requiring expensive equipment and processes.
Innovation Solution
Applying a conductive foil or film directly to the die backside and sidewalls of electronic packages using a physical vapor deposition process, which eliminates the need for sputtering and laser ablation, allowing for more robust and uniform shielding without increasing the package's footprint or thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sputtering or laser trenching is used for EMI shielding, then EMI shielding is achieved, but manufacturing cost and time increase
Solution Approach 1:
The patent changes the deposition method from sputtering or laser trenching to physical vapor deposition (PVD), altering the process parameters to achieve better EMI shielding with improved manufacturing efficiency. The PVD process allows for controlled deposition of conductive materials that provide effective EMI shielding while reducing manufacturing complexity and time.
Solution Approach 2:
The patent replaces the mechanical sputtering process and laser ablation system with a physical vapor deposition system. This substitution eliminates the need for expensive sputtering equipment and complex laser trenching operations, thereby reducing manufacturing cost and time while maintaining EMI shielding effectiveness.
2Reliability
If sputtering or laser trenching is used for EMI shielding, then EMI shielding is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent extracts and eliminates the complex sputtering and laser trenching steps from the manufacturing process, replacing them with a simpler physical vapor deposition process. This extraction of unnecessary complexity reduces manufacturing process steps while maintaining the essential EMI shielding function.
Solution Approach 2:
The patent employs a more economical PVD process that uses readily available conductive materials deposited in a controlled manner, replacing expensive sputtering equipment and complex laser systems. This approach reduces both equipment investment and process complexity.
3Reliability
If conventional EMI shielding methods are used, then shielding is provided, but footprint and thickness increase
Solution Approach 1:
The patent uses thin conductive films deposited through physical vapor deposition to provide EMI shielding. These thin films conform to the package surfaces and provide effective shielding without adding significant thickness or footprint, unlike conventional bulk shielding materials.
4Reliability
If sputtering is used for EMI shielding, then shielding is achieved, but equipment cost increases
Solution Approach 1:
The patent replaces expensive sputtering equipment with a physical vapor deposition system that is more cost-effective and easier to implement. The PVD system uses simpler mechanics to deposit conductive materials, eliminating the need for complex sputtering apparatus while achieving equivalent or superior EMI shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and time, provides more reliable EMI shielding with fewer defects, and allows for closer spacing of components without interference, while using a variety of metal compositions and being easier to apply on curved surfaces.
Implementation Method 1
Applying a conductive foil or film directly to the die backside and sidewalls of electronic packages using a physical vapor deposition process
Data Source
AI summary
Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include substrate including electrical connection circuitry therein, ground circuitry on, or at least partially in the substrate, the ground circuitry at least partially exposed by a surface of the substrate, a die electrically connected to the connection circuitry and the ground circuitry, the die on the substrate, a conductive material on a die backside, and a conductive paste or one or more wires electrically connected to the ground circuitry and the conductive material.