PVD Magnetron Translation Assembly for Uniform Target Erosion
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Solution Overview
Problem
Conventional PVD processes face challenges in achieving film deposition uniformity and efficient target material utilization, particularly when processing large-area substrates, due to costly raw material requirements, brittle target manufacturing issues, and inefficient target erosion in non-circular designs.
Innovation Solution
A magnetron translation assembly with linear and rotational actuators is used to move a magnet assembly across the target surface in a predetermined path, combined with substrate rotation, to ensure even target erosion and deposition uniformity, allowing for simultaneous use of multiple targets and improved target utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If large-area monolithic targets are used to process large-area substrates, then film deposition coverage is improved, but manufacturing difficulty and cost increase due to cracking and breaking
Solution Approach 1:
The patent divides the large-area target into multiple smaller modular target segments that can be independently manufactured and positioned. This segmentation allows each segment to be produced without the cracking and breaking issues that plague large monolithic targets, while still achieving full substrate coverage through coordinated arrangement of multiple segments.
2Device complexity
If conventional stationary magnetron designs are used, then device simplicity is maintained, but target material utilization efficiency deteriorates due to non-uniform erosion
Solution Approach 1:
The patent introduces dynamic movement capabilities to the magnetron assembly, allowing it to translate and rotate during the sputtering process. This dynamic positioning enables uniform erosion of the target material by distributing the plasma bombardment across different areas, significantly improving target material utilization efficiency compared to stationary designs.
Solution Approach 2:
The continuous translation and rotation of the magnetron assembly ensures that the entire target surface is continuously utilized during deposition. This continuous movement prevents localized over-erosion and maintains uniform material removal rates, maximizing the useful action across the entire target area throughout the process.
3Productivity
If multiple targets are positioned in conventional PVD chambers, then throughput is improved, but film deposition uniformity deteriorates due to complex magnetron movements required
Solution Approach 1:
The patent designs a universal magnetron assembly that can be positioned and oriented to process multiple targets simultaneously or sequentially within a single chamber. This multi-functional design achieves high throughput by accommodating multiple targets while maintaining film deposition uniformity through the assembly's ability to perform precise, controlled movements rather than requiring complex independent movements for each target.
4Adaptability or versatility
If non-circular and non-symmetric target designs are used, then adaptability to substrate shapes is improved, but target erosion uniformity worsens due to complex magnetron movements
Solution Approach 1:
The patent employs dynamic translation and rotation of the magnetron assembly to compensate for non-circular and non-symmetric target geometries. By continuously adjusting the magnetron position and orientation during processing, uniform plasma distribution and erosion patterns are achieved across complex target shapes without requiring the magnetron to follow complex predetermined paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances film deposition uniformity and target material efficiency, reducing costs and extending target life while enabling co-sputtering and adjustable film composition.
Implementation Method 1
The magnet array (e.g., magnetron) applies an external magnetic field that traps electrons and confines the plasma close to the target
Implementation Method 2
The high voltage generates an electric field inside the PVD chamber that is used to enable sputtering of the target material and generate and emit electrons from the target
Implementation Method 3
The argon ions are accelerated towards the target due to the negative bias and collide with a surface of the target causing atoms of the target material to be ejected therefrom
Implementation Method 4
The ejected atoms of target material then travel towards the substrate and chamber shielding to incorporate into the growing thin film thereon
Data Source
AI summary
Apparatus and methods for improving film uniformity in a physical vapor deposition (PVD) process are provided herein. In some embodiments, a magnetron translation assembly comprises a first linear actuator assembly with a first rail which is aligned in a first direction and a first actuator that is configured to position a first mount along the first rail; a magnet assembly is mounted on the first mount, the magnet assembly constructed and arranged to be rotated about an axis perpendicular to the first rail; and a second linear actuator assembly comprising a second mount that is configured to be positioned along a second rail, which is aligned in a second direction and the first linear actuator assembly is coupled to a mounting surface of the second mount.