Quantum Chip Air Bridge Fabrication for Denatured Photoresist Removal
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Solution Overview
Problem
The existing methods for preparing air bridges in superconducting quantum chips face challenges with poor removal efficiency of denatured photoresist, which affects the quality of the air bridge and the performance of the quantum chip due to residual denatured photoresist.
Innovation Solution
A method involving photolithography and ion beam milling to create an air bridge, followed by light-illumination and photoresist removal processing to effectively remove denatured photoresist, improving the resist removal efficiency and reducing the time required for the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If ion beam milling processing is performed to prepare the air bridge, then the bridge structure is formed, but the photoresist on the surface layer is denatured and difficult to remove
Solution Approach 1:
The patent applies preliminary action by performing light-illumination processing on the photoresist region before the photoresist removal processing. This preliminary light exposure activates or modifies the denatured photoresist, making it more susceptible to subsequent removal by the resist remover, thereby solving the problem of difficult photoresist removal after ion beam milling
Solution Approach 2:
The patent changes the physical-chemical parameters of the photoresist through light-illumination processing. The light exposure alters the molecular structure or solubility characteristics of the denatured photoresist, transforming it from a state that is resistant to removal into a state that can be effectively removed by the resist remover
2Ease of manufacture
If traditional resist remover is used alone, then the removal process is simple, but the removal effect of denatured photoresist is poor
Solution Approach 1:
The patent merges two processing steps into a combined approach: light-illumination processing followed by photoresist removal processing. This combination integrates the activating effect of light with the dissolving action of the resist remover, achieving both complete removal of denatured photoresist and maintenance of process simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the success rate of air bridge preparation by improving the resist removal efficiency, ensuring better performance and stability of the quantum chip.
Implementation Method 1
performing ion beam milling processing on the substrate with the bridge support structure to obtain an initial air bridge, the ion beam milling processing being configured for denaturing photoresist on a surface layer of the bridge support structure
Implementation Method 2
performing light-illumination processing and photoresist removal processing on a photoresist region comprising denatured photoresist in the initial air bridge
Data Source
AI summary
The present disclosure discloses an air bridge manufacturing method, a quantum chip, and a quantum computer, and relates to the field of quantum chip technologies. One method, performed by a photolithography device, includes constructing a bridge support structure for an air bridge on a substrate with a coplanar waveguide by using photoresist; performing ion beam milling processing on the substrate with the bridge support structure to obtain an initial air bridge, the ion beam milling processing being configured for denaturing photoresist on a surface layer of the bridge support structure; and performing light-illumination processing and photoresist removal processing on a photoresist region comprising denatured photoresist in the initial air bridge, to obtain the air bridge. Through embodiments of the present disclosure, a photoresist removal effect can be improved, and a success rate of air bridge manufacturing can be improved.