Ring-Connected Quantum Chip Layout Without Air Bridges
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Solution Overview
Problem
Designing a superconducting quantum chip with high connectivity is challenging due to limitations in coupling non-adjacent qubits, leading to reduced efficiency and accuracy in quantum gate operations, and existing micro-nano processing technologies face issues with yield and feasibility, especially with the use of air bridge processes.
Innovation Solution
A quantum chip structure featuring a ring of center qubits connected by couplers and linear structures extending from these qubits, allowing for high connectivity without the need for air bridge processes, utilizing 2D micro-nano processing technology to achieve strong and efficient coupling between qubits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If air bridge processes are used to achieve high connectivity between non-adjacent qubits, then connectivity is improved, but manufacturing complexity and yield are worsened
Solution Approach 1:
The patent extracts and eliminates the air bridge process from the manufacturing workflow. By designing a quantum chip structure that achieves high connectivity through standard 2D micro-nano processing without requiring air bridge processes, the solution removes the complex manufacturing step while preserving the essential connectivity function through alternative structural design
Solution Approach 2:
The patent transitions from 3D air bridge structures to a 2D micro-nano processing approach. By redesigning the qubit coupling mechanism to work within the 2D plane using standard processing technologies, the solution achieves comparable connectivity without the manufacturing complexity of 3D air bridge structures
2Adaptability or versatility
If air bridge processes are used to couple non-adjacent qubits, then connectivity is improved, but manufacturing yield is worsened
Solution Approach 1:
The patent removes the air bridge process from the manufacturing sequence, eliminating the source of yield problems. By achieving connectivity through standard 2D processing techniques, the solution avoids the low-yield characteristics inherent in air bridge fabrication
Solution Approach 2:
The patent employs standard, well-established 2D micro-nano processing technologies that are more reliable and have higher manufacturing yields compared to the specialized air bridge process. This substitution of proven, robust processes for fragile, complex ones improves overall manufacturing reliability
3Adaptability or versatility
If complex processing technologies are used to achieve high connectivity, then connectivity is improved, but ease of manufacture is worsened
Solution Approach 1:
The patent extracts the air bridge process requirement from the design specifications, allowing the quantum chip to be manufactured using standard 2D micro-nano processing technologies that are more readily available and easier to implement in existing fabrication facilities
Solution Approach 2:
The patent designs a quantum chip structure that can be manufactured using universal, standard 2D processing technologies that are already widely available in semiconductor fabrication. This multi-functional approach allows the same manufacturing infrastructure to produce the quantum chip without requiring specialized air bridge processing equipment
Data Source
AI summary
Provided are a quantum chip structure, a determining method, a device and a storage medium, and relates to the field of computer technology, and in particular, to the field of quantum computation. The quantum chip structure includes: a ring structure composed of n center qubits, where two adjacent center qubits in the ring structure are connected through a coupler; and n is a natural number greater than or equal to 3; and two-linear structures drawn from a center qubit Qi toward outside of the ring structure; where a first linear structure in the two-linear structures contains ai first qubits; and a second linear structure in the two-linear structures contains bi second qubits. In this way, a quantum chip structure with high connectivity is obtained.