Quantum Chip Interposer Spacing for Stable Cryogenic Probe Pin Contact
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Solution Overview
Problem
Probe pins used for electrical connections between substrates in quantum devices experience instability and signal quality degradation due to substrate deformation and tilting at extreme temperatures, leading to impedance mismatch and connection reliability issues.
Innovation Solution
A quantum device design incorporating a quantum chip, interposer, housing, board, and spacers, with probe pins housed in openings, ensuring a clearance between the housing and interposer to maintain stable connections and signal quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If probe pins are used for electrical connection between substrates, then connection reliability is improved, but substrate deformation at extreme temperatures causes probe pin disconnection
Solution Approach 1:
The probe pin is designed with movable contact portions that can dynamically adjust their position. The first contact portion is movable relative to the first substrate, and the second contact portion is movable relative to the second substrate. This dynamic capability allows the probe pin to accommodate substrate deformation while maintaining electrical connection, resolving the contradiction between connection reliability and substrate stability.
Solution Approach 2:
The probe pin utilizes elastic deformation of its contact portions to adapt to changing conditions. The contact portions can elastically deform to maintain contact pressure and electrical connection despite substrate deformation, changing their physical state to compensate for dimensional changes in the substrates.
2Reliability
If probe pins are pushed into the holding body to accommodate deformation, then connection stability is improved, but the stroke limit is exceeded at extreme temperatures
Solution Approach 1:
The probe pin employs multiple movable contact portions that can dynamically adjust their positions independently. This distributed mobility allows the probe pin to accommodate substrate deformation without requiring excessive stroke from a single contact portion, distributing the displacement demand across multiple flexible contact points.
3Manufacturing precision
If rigid connection structures are used, then manufacturing precision is improved, but impedance mismatch occurs due to substrate tilting
Solution Approach 1:
The probe pin replaces rigid connection structures with dynamic, movable contact portions. These contact portions can adjust their positions to maintain proper alignment and electrical connection even when substrates tilt or deform, preserving signal quality and preventing impedance mismatch while accommodating manufacturing tolerances.
Solution Approach 2:
The movable contact portions can elastically deform and change their physical state to adapt to substrate tilting and deformation. This parameter change capability allows the connection to maintain proper electrical characteristics despite changes in substrate geometry, preventing impedance mismatch.
Data Source
AI summary
A quantum device includes a quantum chip including a superconducting quantum circuit; an interposer including mounting the quantum chip on a first surface thereof; a housing having openings penetrating from a first surface of the housing opposing a second surface of the interposer to a second surface of the housing with probe pins housed in the opening, a board with a first surface facing the second surface of the housing; and one or more spacers between the first surface of the housing and the second surface of the interposer to ensure a clearance between the first surface of the housing and the second surface of the interposer facing the first surface of the housing.