Quantum Dot LED Package With Through-Cavity Reflector
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Solution Overview
Problem
Conventional LED packages using phosphors face limitations in achieving high color gamut, and quantum dot LED modules are susceptible to environmental conditions and heat, leading to poor heat dissipation and variability in LED package lifetime due to differences in thermal resistivity.
Innovation Solution
A quantum dot LED package with a reflector having a through cavity, a quantum dot plate, and an LED chip, where the reflector has lateral protrusions and a resin part for fixing components, and a bendable Cu PCB with heat dissipating properties is used to enhance heat dissipation and thermal equilibrium among quantum dot LED packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If quantum dots are used to replace phosphors for achieving high color gamut, then wavelength conversion performance is improved, but susceptibility to heat, moisture, and oxygen increases
Solution Approach 1:
The patent applies preliminary protective measures by providing a sealed package structure with inert or vacuum atmosphere before quantum dots are exposed to harmful environmental conditions. This prevents degradation by creating a protective barrier in advance, allowing quantum dots to maintain their excellent wavelength conversion performance without suffering from susceptibility to heat, moisture, and oxygen.
Solution Approach 2:
The patent implements an inert atmosphere approach by sealing quantum dots in a package filled with inert gas or vacuum environment. This isolates the quantum dots from oxygen and moisture, preventing oxidation and degradation while maintaining their optical properties, thus resolving the contradiction between high color gamut performance and environmental susceptibility.
2Temperature
If conventional heat dissipating reflectors are used, then heat dissipation structure is provided, but heat dissipation paths are blocked causing poor heat dissipation characteristics
Solution Approach 1:
The patent inverts the conventional reflector design by making the reflector downwardly open and upwardly closed, allowing heat to escape downward through the open bottom surface. This inverted structure eliminates heat path blockage while maintaining the reflector's light-guiding function, improving heat dissipation characteristics without adding device complexity.
Solution Approach 2:
The patent adds a vertical heat dissipation dimension by creating a through-cavity structure that allows heat to escape in the downward direction, complementing the traditional lateral heat dissipation paths. This three-dimensional heat dissipation approach resolves the blockage issue by providing additional heat escape routes without complicating the device structure.
3Temperature
If Al PCB is used for heat dissipation, then heat dissipation performance is provided, but lifetime of quantum dots is reduced and discoloration occurs
Solution Approach 1:
The patent introduces a heat dissipation layer as an intermediary between the Al PCB and quantum dots. This intermediate layer acts as a thermal buffer that conducts heat away from the quantum dots while preventing direct contact with the Al PCB, thus maintaining heat dissipation performance while protecting quantum dots from discoloration and extending their lifetime.
Solution Approach 2:
The patent employs a sacrificial heat dissipation layer that can be easily replaced or regenerated. This layer absorbs the harmful thermal effects from the Al PCB, protecting the expensive quantum dots from degradation. The heat dissipation layer serves as a disposable protective element that extends the lifetime of the valuable quantum dot components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects quantum dots from environmental conditions, improves heat dissipation, and reduces variability in LED package lifetime by maintaining thermal equilibrium, ensuring reliable and compact quantum dot LED modules.
Implementation Method 1
quantum dots (QDs) emitting light of different wavelengths depending on their particle size. Quantum dots have excellent wavelength conversion characteristics due to their quantum confinement effect
Implementation Method 2
a bendable Cu PCB with heat dissipating properties is used to enhance heat dissipation and thermal equilibrium among quantum dot LED packages
Data Source
AI summary
A quantum dot LED package is disclosed. The quantum dot LED package includes: a heat dissipating reflector having a through cavity; a quantum dot plate accommodated in the upper portion of the through cavity; an LED chip accommodated in the lower portion of the through cavity and whose top surface is coupled to the lower surface of the quantum dot plate; electrode pads disposed on the lower surface of the LED chip and protruding more downward than the lower surface of the heat dissipating reflector; and a resin part formed in the through cavity to fix between the LED chip and the reflector and between the quantum dot plate and the reflector.