Quantum Chip Interposer Wiring for Cryogenic Heat Dissipation
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Solution Overview
Problem
Existing quantum devices face challenges in effectively cooling quantum chips and their surrounding areas due to the insulating properties of superconducting materials at extremely low temperatures, which hinder efficient heat dissipation.
Innovation Solution
Incorporating a combination of superconducting and non-superconducting metal layers in the interposer wiring layer of the quantum device, where the non-superconducting material layer facilitates heat transfer at low temperatures, enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If superconducting material is used for wiring layer, then quantum device operation is enabled at low temperature, but heat dissipation capability deteriorates
Solution Approach 1:
The wiring layer is constructed as a composite structure combining superconducting material and normal conducting material. The superconducting material portion maintains quantum device operation at low temperatures with zero electrical resistance, while the normal conducting material portion provides thermal conduction pathways for effective heat dissipation. This composite approach resolves the contradiction by allowing both quantum coherence and thermal management to coexist in the same wiring structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of superconducting and non-superconducting layers improves heat conduction, allowing for effective cooling of quantum chips and their surroundings, thereby maintaining the quantum state for prolonged periods.
Implementation Method 1
the wiring layer includes, in at least a part thereof, a first metal layer formed of a superconducting material and a second metal layer formed of a non-superconducting (i.e., normal conducting) material
Data Source
AI summary
A quantum device capable of effectively cooling a quantum chip and an area (e.g., a space) therearound is provided. A quantum device includes a quantum chip and an interposer on which the quantum chip is located. The interposer includes an interposer substrate and an interposer wiring layer. The interposer wiring layer is disposed on a surface of the interposer substrate on a side on which the quantum chip is located. The interposer wiring layer includes, in at least a part thereof, a superconducting material layer formed of a superconducting material and a non-superconducting material layer formed of a non-superconducting material.