Quartz Oscillator Package Layout Without Ceramic Base Alignment
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Solution Overview
Problem
Existing semiconductor packaging technologies for quartz crystal oscillators face issues with adhesive aging, leading to performance degradation and increased fabrication costs due to the need for precise alignment of ceramic layers, which is difficult and costly to achieve.
Innovation Solution
A temperature-controlled oscillating device is designed with a quartz crystal package comprising three stacked quartz substrates, integrated circuit, conducting medium, temperature sensor, and heater, eliminating the need for a ceramic base and adhesive, thereby avoiding performance degradation and reducing fabrication costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic layers are used to package the quartz crystal, then the quartz crystal can be protected and mounted, but the ceramic layers are difficult to align precisely and the structure cannot be minimized
Solution Approach 1:
The patent removes the ceramic base layer from the traditional packaging structure, extracting the problematic alignment requirement while maintaining the protective function through direct mounting of the quartz crystal resonator onto the circuit board
Solution Approach 2:
The patent merges the quartz crystal resonator directly with the circuit board by eliminating the intermediate ceramic base, integrating the packaging function into the board structure itself and achieving miniaturization
2Reliability
If adhesive is used to mount the quartz crystal on the ceramic base, then the quartz crystal can be fixed in position, but the adhesive ages and causes performance degradation
Solution Approach 1:
The patent eliminates the adhesive layer from the mounting structure by removing the ceramic base, allowing the quartz crystal resonator to be directly fixed to the circuit board through alternative mounting methods that do not rely on adhesive
Solution Approach 2:
The patent replaces the long-term stable but aging adhesive with a different mounting approach that may use shorter-lived but more reliable mechanical fixation methods integrated into the board structure
3Reliability
If multiple ceramic layers are stacked to package the quartz crystal, then the quartz crystal can be protected, but the fabrication cost increases due to the need for precise alignment
Solution Approach 1:
The patent removes the multi-layer ceramic structure and replaces it with a simplified direct-mounting configuration, eliminating the costly precision alignment process while maintaining protective functionality
Solution Approach 2:
The patent replaces the expensive multi-layer ceramic packaging with a simpler, lower-cost mounting structure that achieves the same protective function without requiring precision fabrication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains quartz crystal performance, achieves miniaturization, and lowers fabrication costs by stacking the quartz crystal package directly on the integrated circuit without a ceramic base, addressing the limitations of existing technologies.
Implementation Method 1
a heater... The heater is formed on the quartz crystal package or the IC
Implementation Method 2
a temperature sensor... The conducting medium and the temperature sensor are formed on the IC
Implementation Method 3
Since taking a quartz crystal piezoelectric element as an oscillator provides an outstanding accuracy and stability
Data Source
AI summary
A temperature-controlled oscillating device includes a supporting base, a mounting glue, an IC, at least one conducting medium, a temperature sensor, a quartz crystal package, and a heater. The mounting glue is formed on the supporting base. The IC is formed on the mounting glue. The conducting medium and the temperature sensor are formed on the IC. The quartz crystal package is formed on the conducting medium. The quartz crystal package includes a first quartz substrate, a second quartz substrate, and a third quartz substrate. The heater is formed on the quartz crystal package or the IC. There is no base arranged between the IC and the quartz crystal package.