Quilt Package Nodule Self-Assembly for Chip Alignment
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Solution Overview
Problem
Current System in Package (SiP) technologies face challenges in ensuring precise alignment and electrical connection of microchips with quilt packaging (QP) nodules, which can be prone to misalignment and inefficient electrical connectivity due to the manufacturing process limitations.
Innovation Solution
The development of a substrate assembly with complementary, interlocking shapes and electrically conductive quilt package nodules that protrude beyond the edges of microchips, allowing for automated assembly in a single orientation and ensuring secure mechanical and electrical connections between microchips, using semiconductor materials and fabrication techniques like photolithography and etching to form these nodules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If quilt packaging nodules are used for chip-to-chip interconnection, then electrical connectivity between microchips is enabled, but misalignment and assembly precision issues occur
Solution Approach 1:
The patent employs asymmetric interlocking shapes (protrusions and recesses) on the quilt packaging nodules that are complementary to each other. This asymmetric design ensures that the nodules can only fit together in one specific orientation, thereby eliminating misalignment issues during automated assembly while maintaining reliable electrical connectivity between microchips.
2Productivity
If automated assembly is implemented, then productivity increases, but alignment precision and orientation control become challenging
Solution Approach 1:
The patent incorporates pre-formed protrusions and recesses with interlocking shapes on the quilt packaging nodules before the assembly process. These pre-configured geometric features guide the microchips into the correct orientation during automated assembly, eliminating the need for complex alignment mechanisms and enabling high-speed automated assembly with precise orientation control.
3Stability of the object's composition
If complementary interlocking shapes are used on substrates, then mechanical stability and single-orientation assembly are achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the quilt packaging nodules themselves: electrical connection, mechanical interlocking, and alignment guidance are all integrated into the same nodule structure. The protrusions and recesses serve both as mechanical interlocks for stability and as alignment features for precise orientation, eliminating the need for separate components and reducing overall device complexity.
Data Source
AI summary
A method of forming a quilt package nodule includes forming a trench in a microchip substrate, forming a metal layer on the bottom, the first and second sides of the trench, and on a top surface of the microchip substrate proximate the first and second sides. forming a mask layer on the metal layer, removing portions of the mask and metal layers on the bottom of the trench, etching the bottom of the trench to increase the depth of the bottom of the trench, removing remaining portions of the mask layer from the metal layer to define the quilt package nodules that protrude beyond edges of the first and second sides, and removing the remaining portion of the trench bottom thereby separating the first and second sides from each other, whereupon each side includes at least one quilt package nodule protruding from the side.