Rack Cooling Arrangement with Anti-Parallel Heat Exchangers
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Solution Overview
Problem
Current cooling infrastructure for data centers faces challenges in scalability, high costs, and the cost of providing redundancy, particularly due to inefficiencies in air-to-liquid heat exchanger designs and the combination of air-to-liquid and liquid cooling units, which lead to temperature stratification and space occupancy issues, as well as difficulties in monitoring and maintaining cooling efficiency.
Innovation Solution
A cooling arrangement featuring a closed loop for liquid cooling and an open loop for air cooling, with dual-flow air-to-liquid heat exchangers assembled in an anti-parallel configuration to reduce temperature stratification and enhance cooling efficiency, while allowing for redundancy and easier maintenance, and a liquid-to-liquid heat exchanger system with redundant components for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional air-to-liquid heat exchangers are used, then cooling is provided to rack-mounted equipment, but temperature stratification occurs and cooling efficiency decreases
Solution Approach 1:
The heat exchanger is divided into multiple flow paths (first flow path and second flow path) that process different portions of the airflow separately. This segmentation allows each path to handle a more uniform temperature range, preventing stratification and improving overall cooling efficiency
Solution Approach 2:
The invention introduces a multi-dimensional approach by creating parallel flow paths that process airflow at different levels. The first flow path handles upper airflow while the second flow path handles lower airflow, effectively adding a vertical dimension to the cooling process and eliminating temperature stratification
2Reliability
If redundant cooling components are added, then reliability is improved, but device complexity and space occupancy increase
Solution Approach 1:
The invention merges the first and second flow paths into a single integrated heat exchanger assembly. The frames are coupled together with airflow passages positioned between them, creating a compact redundant system that maintains reliability while minimizing space occupancy and structural complexity
Solution Approach 2:
The dual flow paths are nested within a shared structural framework. The first and second frames are coupled together with their airflow passages positioned between them, allowing the redundant cooling paths to be nested in a compact configuration that reduces overall system complexity
3Area of stationary object
If more piping lines are used for cooling, then cooling coverage is improved, but capital expenses and operational expenses increase
Solution Approach 1:
The invention merges the piping requirements of two redundant cooling paths into a single integrated assembly. By coupling the frames together and positioning airflow passages between them, the system achieves broad cooling coverage while minimizing the number of separate piping lines and reducing both capital and operational expenses
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves a homogeneous temperature profile for airflow, reduces the number of piping lines by 50%, decreases capital and operational expenses by 25%, and enhances thermal efficiency by 33%, allowing for more reliable and efficient cooling with reduced equipment failure impacts.
Implementation Method 1
A liquid-to-liquid heat exchanger cools the hot liquid from the closed loop by thermal transfer to the warm liquid from the open loop
Implementation Method 2
An open loop provides cooling for air expelled from the rack by the at least one fan. Cold liquid is fed to the open loop and is brought to a warm temperature by the air expelled by the rack
Data Source
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AI summary
A cooling arrangement for autonomous cooling of a rack hosting components and fans comprises a closed loop and an open loop. Liquid cooling is used in the closed loop to transfer heat from heat-generating units of the components to a primary side of a liquid-to-liquid heat exchanger. An air-to-liquid cooling unit is used in the open loop to absorb heat expelled from the rack by the fans. A liquid from a cold supply line is first heated to some degree in the air-to-liquid cooling unit before reaching a secondary side of the liquid-to-liquid heat exchanger. The primary side being hotter than the secondary side, heat is transferred from the primary side to the secondary side of the liquid-to-liquid heat exchanger. The liquid is expelled at a higher temperature from the secondary side to a hot return line.