Radar Heat Dissipation Assembly with Molded ESD Bonding
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Solution Overview
Problem
Existing solutions for heat dissipation in millimeter-wave radars of autonomous vehicles face challenges such as electrostatic discharge between metal structural parts and circuit boards, leading to potential damage and increased costs, while also occupying layout space and compromising structural strength.
Innovation Solution
An electronic apparatus with a metal heat dissipation member and a circuit board, connected via an integrally molded electrical connection member, ensures equipotential bonding and structural integrity by eliminating electrostatic discharge without additional structural parts, thus enhancing reliability and reducing space occupation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal structural part is added for heat dissipation, then heat dissipation performance is improved, but electrostatic discharge occurs between the metal structural part and the circuit board
Solution Approach 1:
An electrical connection member serving as an intermediary component is introduced between the metal heat dissipation member and the circuit board. This intermediary provides both electrical connection and electrostatic discharge protection, allowing the metal structural part to perform heat dissipation without direct contact with the circuit board, thereby resolving the electrostatic discharge risk while maintaining heat dissipation performance
2Reliability
If surface-mount technology is introduced to mount a spring or clamp a structural part, then electrostatic discharge problem is resolved, but costs increase and layout area is occupied
Solution Approach 1:
The electrical connection member integrates multiple functions into a single component: it provides electrical connection between the metal heat dissipation member and the circuit board, offers electrostatic discharge protection, and eliminates the need for additional structural parts like springs or clamps. This merging of functions reduces device complexity, lowers costs, and frees up layout area while maintaining electrostatic discharge protection
3Reliability
If additional structural parts are introduced for electrostatic discharge protection, then electrostatic discharge problem is resolved, but structural strength deteriorates
Solution Approach 1:
The electrical connection member is designed as an integrated component that provides electrostatic discharge protection without requiring additional structural parts that would compromise structural strength. By combining electrical connection and ESD protection functions into a single well-integrated component, the overall structural integrity is maintained while achieving the required electrostatic discharge protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents electrostatic discharge, maintains structural strength, and reduces costs by integrating the electrical connection member into the housing, ensuring reliable contact and efficient heat dissipation.
Implementation Method 1
one end of the electrical connection member is electrically connected to the grounding layer, and the other end of the electrical connection member is electrically connected to the metal heat dissipation member
Implementation Method 2
a metal heat dissipation member... located between the base plate and the circuit board... efficient heat dissipation
Data Source
Figure 1
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Figure 4
AI summary
An electronic apparatus, a terminal device, and a radar are provided. The electronic apparatus (10) includes a housing (100), a metal heat dissipation member (200), an electrical connection member (300), and a circuit board (400). The metal heat dissipation member (200) and the circuit board (400) are located in the housing (100), and the metal heat dissipation member (200) is located between a base plate (110) and the circuit board (400) in the housing (100). The circuit board (400) includes a grounding layer (410) and an electronic device (420), the electrical connection member (300) is integrally molded into the housing (100) through injection and is fixedly connected to the housing (100), one end of the electrical connection member (300) is electrically connected to the grounding layer, and the other end of the electrical connection member (300) is electrically connected to the metal heat dissipation member (200). The electronic apparatus (10) may eliminate an electrostatic discharge phenomenon between the metal heat dissipation member (200) and the circuit board (400) to prevent electrostatic discharge from damaging the electronic device (420) on the circuit board (400). In addition, the circuit board (400) is fastened to the housing (100) by using the electrical connection member (300), and the metal heat dissipation member (200) is fastened between the circuit board (400) and the base plate (110), thereby improving structural strength of the electronic apparatus (10).