Magnetic/Electric Field Screening TRIZ Cases

A concentric dual-coil sensor uses direct substrate bonding and shielding to detect weak signals despite embedded metal.

This case combines aluminum powder with polymer or wax bases to improve high-frequency EMI attenuation and thermal conductivity.

This case uses an adhesive layer with controlled repulsion to distribute bending stress across a multilayer electromagnetic shielding film.

A dual-sided display case uses separate internal heat exchange loops and isolation walls to balance cooling and water resistance.

This radar housing integrates EMC shielding, structural support, and heat dissipation to reduce components, cost, and assembly time.

This sensor case uses hardware key storage and encryption to protect vehicle data exchange from unauthorized access and manipulation.

Absorber sheets terminate unused ports, reducing reflections during crosstalk tests.

Surface modification improves non-polar solvent dispersibility while preserving MXene conductivity for films and polymer composites.

This case shows how a radar housing uses its base for heat dissipation while supporting the PCB and shielding, simplifying assembly.

Cold spraying and annealing enable curved composite molding without metal-layer delamination.

Energy conversion segments suppress EMI propagation while preserving load performance.

A recessed CAMM carrier and retention plate support top modules while foil shielding and vent holes improve grounding and heat dissipation.

A vented carrier and shield can secure top CAMMs, improve grounding, and reduce hot spot temperatures by up to 14°C.

This case routes a heat pipe through a circuit board shield while an auxiliary shield limits noise leakage and frees component layout space.

Molded grounding links heat dissipation metal to the circuit board, limiting ESD risk.

A bracket fastening plate stabilizes the bent FPC, preventing floating and helping the display meet slim thickness specifications.

Metallic walls and conductive pedestals shield interference while supporting grounding and heat dissipation in electronic assemblies.

Separate shielding cases add height to stacked boards; a shared cover preserves shielding while simplifying the assembly.

This case uses recessed or penetrating structures to broaden magnetic-loss absorption and reduce secondary EMI near dense modules.

This case uses protective-layer permittivity and dielectric thickness ranges to preserve target absorption peaks in high-frequency bands.

Merging shielding and absorption into one layer reduces cable thickness while maintaining effective electromagnetic wave suppression.

Shield plate isolates control board from inverter to reduce electromagnetic interference.

Shield cans replace screws to fix stacked circuit boards in vehicle camera modules, reducing part count and assembly complexity.

Radial overlap of the spiral shield prevents electromagnetic wave leakage when the wiring harness bends.

Segmented metallic case with internal partition wall intercepts eddy current noise, preventing superimposition on low-voltage filter circuits.

A transparent film with a frequency selective surface structure reduces specific absorption rate by 56% while maintaining display transparency.

Housing member opening reduces radiation noise by blocking electromagnetic wave propagation without adding absorbing sheets.

Additive manufacturing creates continuous metallic structures directly on printed circuit boards to integrate shielding and heat dissipation.

A secure keypad uses optical detection to identify finger positions on a touch screen.

Overlapping conductive segments form a discontinuous shield that minimizes electromagnetic interference and alien crosstalk without continuous grounding.

An antistatic layer dissipates static electricity on plastic substrates, preventing component breakdown and image quality loss.

A heat management system uses independently movable heat sink elements biased against an electronic module to ensure effective thermal contact.

An interlocking EMI shield replaces paste application to prevent component contamination while attenuating electromagnetic fields.

Multilayer printed wiring board ground plane connects to conductive housing, eliminating separate shield members to reduce component count and size.

A transparent antenna flange uses a lens part to position the film from the visible side of a ceiling.

A segmented electromagnetic wave absorber uses slits to divide resistive layers into blocks, enabling flexible attachment to curved surfaces.

An integrated antenna device merges the radiator and a planar grounding element to function as an electromagnetic interference shield.

Vibrating the shielding cover via a piezoelectric element creates dynamic airflow that expels thermal energy from electronic components.

A detachable EMI shielding frame uses double V-cut connections to enable easy installation and balanced handling of electronic components.

A conductive mounting structure diverts transient electrical spikes through an alternative path.

Opposite spiral winding of resin-backed magnetic tapes around a cable core resolves the trade-off between high permeability and mechanical flexibility.

A printed board uses a resonance trace loop to confine electromagnetic noise between frame ground and circuit members.

Protrusions on the conductive shielding film intercept electrostatic discharge to prevent damage in highly integrated display devices.

Hollow ground plane structures reduce parasitic capacitance and dielectric loss, enabling reliable operation in demanding high-frequency circuit applications.

A polyhedral antenna device uses a conductive frame body to fix adjacent surface members and prevent radio wave interference at structural joints.

A conductive cloth bridges metallic front and back housings around a panel module, preventing electromagnetic radiation leakage without adding device weight.

Elastomeric bumpers elastically deform under physical shock to dissipate impact energy, preventing rigid transfer of force to internal electronic assemblies.

A textile digital band integrates conductive yarns into parallel warp and weft structures to enable high-speed communication paths.

Flexible elastomer substrates with embedded liquid conductors enable dynamic frequency tuning and scattering suppression for microwave applications.