Stacked Circuit Board Assembly With Shared Cover for Compact Layout

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Solution Overview

Problem

Stack-type circuit boards occupy a large vertical space due to the need for electromagnetic shielding cases, which contradicts the requirement for efficient space utilization in electronic devices.

Innovation Solution

A circuit board assembly design where shielding frames on opposite surfaces of adjacent circuit boards share a shared shielding cover, reducing vertical space while maintaining electromagnetic shielding efficacy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a shielding case is provided for each electronic component requiring electromagnetic shielding in a stack-type circuit board, then the electromagnetic shielding needs of components are satisfied, but the vertical dimension of the circuit board assembly increases, occupying more vertical space

Engineering Contradiction:
Improveelectromagnetic shielding effectivenessVSAvoidvertical dimension of circuit board assembly
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent merges multiple separate shielding cases into a single shared shielding cover that serves multiple circuit boards simultaneously. The shared shielding cover is positioned between adjacent circuit boards and provides electromagnetic shielding for components on both sides, eliminating the need for separate shielding cases for each board and reducing the overall vertical dimension of the assembly.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The shared shielding cover performs multiple functions: it shields electronic components on the first circuit board from electromagnetic interference, shields components on the second circuit board from interference, and structurally connects the adjacent circuit boards together. This multi-functional design replaces what would traditionally require multiple separate shielding cases.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple separate shielding cases are used for adjacent circuit boards, then each component's shielding needs are met, but the device complexity and number of parts increase

Engineering Contradiction:
Improveelectromagnetic shielding effectivenessVSAvoidnumber of shielding components
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple separate shielding cases into a single integrated shared shielding cover structure. Instead of having independent shielding cases for each circuit board, the shared shielding cover is designed to accommodate and shield components across multiple adjacent circuit boards, thereby reducing the total number of shielding components and simplifying the overall device structure.

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If traditional two-dimensional planar circuit boards are used, then the structure is simple, but the space utilization is inefficient and more horizontal space is occupied

Engineering Contradiction:
Improvecircuit board structureVSAvoidhorizontal space occupied
Core Design Contradiction:
Device complexityVSArea of stationary object

Solution Approach 1:

The patent transitions from traditional two-dimensional planar circuit board arrangement to a three-dimensional stack-type configuration where multiple circuit boards are vertically stacked. This dimensional change allows the system to utilize vertical space instead of horizontal space, significantly improving space utilization efficiency while maintaining relatively simple circuit board structures.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12369288B2Circuit board assembly and electronic device
Publication Date: 2025.07.22 HONOR DEVICE CO LTD
  • US12369288B2 patent drawing
  • US12369288B2 patent drawing
  • US12369288B2 patent drawing

AI summary

Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, where the first circuit board is provided with a first shielding frame on a surface facing toward the second circuit board, the second circuit board is provided with a second shielding frame on a surface facing toward the first circuit board, and opposite end portions of the first shielding frame and the second shielding frame are connected to a shared shielding cover, so that the shared shielding cover, the first shielding frame, and the second shielding frame enclose a shielding cavity.