Stacked CAMM Carrier Assembly With Retention Hooks and Thermal Venting

The patent segments the thermal management function by introducing separate thermal vias, ground planes, and heat dissipation paths for each CAMM layer. The carrier board is divided into multiple ground planes (first ground plane, second ground plane) that are electrically connected through thermal vias, creating distributed thermal management zones that prevent heat concentration in any single area.

The patent introduces intermediary thermal management components including thermal vias that act as heat transfer mediators between different CAMM layers and ground planes. These thermal vias serve as intermediate conduits to conduct heat away from the stacked memory modules to external heat sinks or dissipation paths, preventing thermal hot spots.

The patent merges multiple support functions into a unified carrier board structure that provides mechanical support, electrical connection, and thermal management simultaneously. The carrier board integrates first and second recesses, multiple ground planes, and retention mechanisms into a single stable platform that collectively supports the stacked CAMMs, improving overall mechanical stability.

The patent incorporates preliminary support structures including retention clips, ground planes, and thermal vias that are pre-configured in the carrier board before the CAMMs are installed. These preliminary structures ensure that when CAMMs are stacked, they are immediately supported and secured, preventing mechanical instability and ensuring secure affixing from the outset.

The patent implements multi-functional ground planes that simultaneously provide EMI shielding, thermal management, and electrical grounding functions. The first and second ground planes serve multiple purposes: they act as EMI shields between stacked CAMMs, provide thermal conduction paths through thermal vias, and establish electrical ground references. This eliminates the need for separate shield cans, reducing structural complexity while maintaining EMI protection.

The patent merges the EMI shielding function with the existing ground plane structure and carrier board design. Instead of adding separate shield cans, the ground planes are configured to provide both electrical grounding and electromagnetic shielding, combining multiple protective functions into a unified structure that reduces overall device complexity.