Radar Positioning for Semiconductor Wafer Handling Robots
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Solution Overview
Problem
Modern semiconductor process technology faces challenges in achieving high positional repeatability and accuracy for wafer handling robots, as traditional methods rely on mechanical transmission precision and external sensors, which are prone to errors due to mechanical wear, thermal expansion, and payload weight-related issues.
Innovation Solution
A positioning system using radar, optical, or sonar systems mounted on the robot arm, end effector, substrate, or substrate process module to emit and receive energy, allowing for non-contact sensing of the substrate and robot positions, enabling accurate determination of location, range, angle, and velocity relative to the processing module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional mechanical transmission and external sensors are used for position measurement, then the system structure is simple, but positional accuracy and repeatability deteriorate due to mechanical wear, thermal expansion, and payload weight
Solution Approach 1:
The patent replaces traditional mechanical transmission-based position measurement with radar, optical, or sonar sensing systems. These non-contact sensing systems emit energy and receive reflections to determine substrate and robot arm positions, eliminating dependence on mechanical transmission precision and external sensors prone to wear and thermal effects.
Solution Approach 2:
The patent introduces energy (radar, optical, or sonar waves) as an intermediary between the sensing system and the substrate/robot arm. This energy medium carries position information without physical contact, allowing accurate measurement while avoiding mechanical wear, thermal expansion, and payload weight issues that affect traditional mechanical systems.
2Measurement precision
If non-contact sensing systems are mounted on robot arm or substrate, then positional accuracy improves, but device complexity increases
Solution Approach 1:
The patent employs multi-functional mounting configurations where emitters and receivers can be mounted on various components (robot arm, end effector, substrate, or substrate process module). This universal mounting approach allows the same sensing system to serve multiple measurement functions and adapt to different operational scenarios, justifying the increased device complexity through enhanced versatility and accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances positional accuracy and adaptability by compensating for mechanical wear and thermal changes, improving the precision of wafer handling and processing by using non-contact sensing systems to measure and correct for initial wafer position and slippage.
Implementation Method 1
A positioning system using radar, optical, or sonar systems mounted on the robot arm, end effector, substrate, or substrate process module to emit and receive energy
Implementation Method 2
at least one receiver configured to receive the emitted energy
Data Source
AI summary
An apparatus including at least one emitter configured to emit energy; at least one receiver configured to receive the emitted energy, where the at least one emitter is mounted on at least one of: a robot arm, an end effector of the robot arm, a substrate on the robot arm, or a substrate process module, where the at least one receiver is mounted on at least one of: the robot arm, the end effector of the robot arm, the substrate on the robot arm, or the substrate process module.