Radiation-Hardened Data Acquisition ASIC for Low-Power Spacecraft Telemetry
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Solution Overview
Problem
Spacecraft electronic systems face challenges due to radiation exposure, with existing integrated circuits being 'soft' and not suitable for space applications due to lack of radiation tolerance, leading to increased size, weight, power consumption, and complexity in data collection systems.
Innovation Solution
A radiation hardened low-power data acquisition system-on-chip (SOC) is developed, incorporating a radiation hardened semiconductor die with a multiplexer, analog-to-digital converter, and serial communication interface, designed to withstand radiation exposure and reduce system complexity by combining analog, digital, and mixed-signal functions on a single silicon die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete components (analog-to-digital converters, multiplexers, amplifiers, memory) are used for data collection, then radiation tolerance is improved, but device complexity and size increase
Solution Approach 1:
The patent combines multiple discrete components (analog-to-digital converters, multiplexers, amplifiers, memory, and processing units) into a single integrated radiation-hardened data acquisition chip. This integration maintains radiation tolerance while reducing interconnectivity complexity, size, and weight by consolidating these functions onto one semiconductor device rather than using separate discrete components.
Solution Approach 2:
The integrated data acquisition chip performs multiple functions simultaneously - analog signal conditioning, digital conversion, data processing, and memory storage - all within a single radiation-hardened device. This multi-functionality eliminates the need for multiple specialized discrete components while maintaining reliability in radiation environments.
2Reliability
If multiple discrete components are used for data acquisition, then radiation hardness is achieved, but weight and power consumption increase
Solution Approach 1:
By merging multiple discrete radiation-hardened components into a single integrated chip, the patent significantly reduces system weight. The consolidated design eliminates redundant packaging, interconnectors, and support structures required for multiple separate components while maintaining all necessary radiation-hardened functions.
3Reliability
If discrete components are used for spacecraft data collection, then radiation tolerance is maintained, but volume and manufacturing complexity increase
Solution Approach 1:
The integration of multiple discrete components into a single chip dramatically reduces the volume occupied by the data acquisition system. Instead of requiring separate packages and mounting space for analog-to-digital converters, multiplexers, amplifiers, and memory, all functions are consolidated onto one compact semiconductor device.
4Device complexity
If soft integrated circuits are used, then device complexity is reduced, but radiation tolerance is lost
Solution Approach 1:
The patent achieves both reduced complexity and radiation tolerance by integrating multiple radiation-hardened functions into a single chip. This approach maintains the simplicity of an integrated circuit while incorporating radiation-hardening techniques throughout the design, avoiding the need for complex discrete component assemblies.
Data Source
AI summary
Embodiments may provide a radiation hardened low-power data acquisition system-on-chip (SOC) suitable for space flight. The various embodiments may provide the radiation hardened low-power data acquisition SOC having a radiation hardened semiconductor die, a radiation hardened multiplexer integrated on the radiation hardened semiconductor die and configured to receive a plurality of analog signals and selectively output an analog signal of the plurality of analog signals, at least one radiation hardened analog to digital converted integrated on the radiation hardened semiconductor die and configured to convert the analog signal to a digital signal, and a radiation hardened serial communication interface integrated on the radiation hardened semiconductor die and configured to output the digital signal. The various embodiments may provide a computing having a processor and the radiation hardened low-power data acquisition SOC electrically coupled to the processor such that the digital signal is output to the processor.