Radial Fin Heat Sink Layout for IC Hot Spot Cooling
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Solution Overview
Problem
Existing heat dissipation structures in electronic circuits are inefficient in dissipating heat from high-density heat-generating devices, leading to potential performance reduction and permanent damage due to inadequate convective cooling.
Innovation Solution
A heat-dissipation structure featuring a first substrate with orthogonal and radial fins, where a fan forces air radially outward between the fins to enhance convective cooling, coupled with a second substrate for thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional heat dissipation structures are used, then the structure is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation structure is segmented into multiple functional components: a substrate for heat conduction, multiple fins extending in different directions (orthogonal and radial) for increased surface area, and a fan for forced convection. This segmentation allows each component to optimize its specific function while collectively achieving superior heat dissipation efficiency compared to simple conventional structures.
Solution Approach 2:
The patent introduces radial fins that extend in multiple directions from the substrate, adding dimensional complexity to the heat dissipation approach. Instead of simple parallel fins, the radial configuration creates a three-dimensional heat dissipation network that increases surface area exposure to cooling air flows, thereby improving heat transfer efficiency.
2Productivity
If high-density transistor fabrication is used, then circuit integration is improved, but heat generation density increases
Solution Approach 1:
The heat dissipation structure employs local quality by concentrating thermal management resources at the heat-generating substrate location. The fins are strategically positioned and oriented to maximize heat extraction from the substrate surface, with radial fins providing enhanced cooling in directions where heat flux is highest, thereby addressing the localized thermal challenge created by high-density transistor fabrication.
3Productivity
If convective cooling is enhanced, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent merges conduction and convection cooling mechanisms into a single integrated heat dissipation system. The substrate conducts heat from the transistor array to its surface, where multiple fins and a fan work together to dissipate heat through forced convection. This merging of thermal management approaches in one structure achieves high heat dissipation rates without requiring separate, complex cooling systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively conducts heat radially outward through fins, providing enhanced convective cooling and reducing temperature increases, thereby preventing performance degradation and damage.
Implementation Method 1
Heat in the first region may be conducted radially outward through the fins to cool the first region
Implementation Method 2
a fan may be disposed in the first region of the first substrate to force air radially outward between the fins to dissipate the heat from the fins convectively
Data Source
AI summary
A heat-generating device, such as an integrated circuit (IC), including electronic circuits, creates a hot spot in a package from which heat needs to be dissipated at an adequate rate to prevent a temperature increase that could reduce performance or cause permanent damage. A heat-dissipation structure includes a first substrate, including a first side from which a plurality of fins extend orthogonally to a second substrate. The fins also extend radially from a first region of the first side of the first substrate. Heat in the first region may be conducted radially outward through the fins to cool the first region. In some examples, a fan may be disposed in the first region of the first substrate to force air radially outward between the fins to dissipate the heat from the fins. In some examples, a heat-generating device may be disposed on a second side of the first substrate.