Microwave Plasma Device Radial Power Transmission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional plasma processing systems face challenges in achieving uniform plasma density across substrates, particularly at the edge, due to non-uniform power emission from plasma sources, leading to non-uniform etching or film deposition.
Innovation Solution
A plasma processing system incorporating surface wave plasma sources with a power transmission element featuring an interior cavity and a continuous slit, along with a dielectric component, to propagate electromagnetic energy uniformly across the plasma chamber, and optionally combining multiple plasma sources to enhance plasma density control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If plasma sources are located opposite or parallel to the substrate, then the plasma source can be positioned for direct exposure, but the plasma density becomes non-uniform across the substrate
Solution Approach 1:
The patent transitions from conventional parallel or opposite plasma source positioning to a radial configuration where the plasma source surrounds the substrate in a different spatial dimension. This radial arrangement allows electromagnetic energy to be delivered uniformly from all directions around the substrate perimeter, resolving the non-uniform plasma density issue while maintaining direct exposure geometry.
Solution Approach 2:
The plasma source is designed with non-uniform power distribution characteristics specifically tailored for radial geometry. The electromagnetic energy emission is optimized to account for the radial distance variations, ensuring that each region of the substrate receives appropriate energy density for uniform plasma generation across the entire substrate surface.
2Manufacturing precision
If the plasma source size is increased to improve plasma density uniformity, then plasma density uniformity may improve, but the device becomes impractical or impossible to implement
Solution Approach 1:
Instead of increasing the plasma source size in the conventional planar dimension, the patent employs a radial configuration where the plasma source is distributed around the substrate perimeter. This dimensional change allows uniform plasma density to be achieved through geometric arrangement rather than simply enlarging the source, avoiding practical implementation issues.
Solution Approach 2:
The plasma source is segmented into multiple radial segments or zones that independently deliver electromagnetic energy to different regions of the substrate. This segmentation allows each segment to be optimized for its specific region while collectively achieving uniform plasma density across the entire substrate, avoiding the need for a single large complex source.
3Device complexity
If conventional plasma sources are used, then the system structure is simple, but the plasma density near the edge of the substrate is non-uniform
Solution Approach 1:
The patent implements a radial plasma source configuration that delivers electromagnetic energy from the substrate perimeter inward, creating a different energy delivery geometry compared to conventional top-down or side-mounted sources. This radial dimensionality change naturally improves edge plasma density uniformity by reducing the distance and angular variation for edge regions.
Solution Approach 2:
The electromagnetic energy emission is optimized with local quality considerations for different radial zones. The power distribution, frequency, and emission characteristics are tailored to compensate for edge effects and ensure uniform plasma density across the substrate, particularly improving performance at the edges where conventional sources fail.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved plasma density uniformity across the substrate, ensuring consistent etching or film deposition processes by optimizing electromagnetic energy distribution and combining plasma sources for enhanced control over the plasma density profile.
Implementation Method 1
One of the power transmission elements may include an interior cavity that can propagate electromagnetic waves that may be provided by a power source
Implementation Method 2
The plasma chamber may include one or more surface wave plasma sources (e.g., power transmission elements) that can emit electromagnetic energy to ionize gas
Implementation Method 3
The continuous slit may include a dielectric component that may be arranged to cover at least a portion of the continuous slit or opening. The dielectric component may be configured to enable the transmission electromagnetic energy or power signal into the plasma chamber
Data Source
AI summary
A processing system is disclosed, having a power transmission element with an interior cavity that propagates electromagnetic energy proximate to a continuous slit in the interior cavity. The continuous slit forms an opening between the interior cavity and a substrate processing chamber. The electromagnetic energy may generate an alternating charge in the continuous slit that enables the generation of an electric field that may propagate into the processing chamber. The electromagnetic energy may be conditioned prior to entering the interior cavity to improve uniformity or stability of the electric field. The conditioning may include, but is not limited to, phase angle, field angle, and number of feeds into the interior cavity.


