Radial Offset Fin Heat Exchanger for Electronic Enclosure Cooling

Solution Overview

Problem

Existing heat exchangers face challenges in efficiently transferring heat due to the use of traditional lanced and offset fin configurations, which are time-consuming to produce and can result in gaps between fin pieces, reducing strength and heat transfer efficiency.

Innovation Solution

The use of additive manufacturing techniques to fabricate lanced and offset fin geometry along a radial path, eliminating abrupt turns and allowing for continuous radius designs, thereby enhancing heat transfer capability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional lanced and offset fin configurations are used, then heat transfer surface area is increased, but production time is excessive and gaps between fin pieces reduce heat transfer efficiency

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidproduction time

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent combines multiple fin pieces into a single continuous fin structure that follows the curved offset path. This eliminates gaps between fin pieces and reduces the number of assembly steps, thereby improving heat transfer efficiency while significantly reducing production time.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent employs curved offset fins that follow a smooth radial path around the tube rather than using sharp angular transitions. This curved geometry eliminates abrupt fluid turns, improves heat transfer by maintaining continuous surface contact, and allows for more efficient manufacturing as a single piece.

Inventive Principle:

Principle #14Spheroidality (Curvature)

2Manufacturing precision

If traditional lanced and offset fin configurations are used, then heat transfer surface area is increased, but gaps between fin pieces reduce structural strength

Engineering Contradiction:

Improveheat transfer efficiencyVSAvoidstructural strength

Core Design Contradiction:

Manufacturing precisionVSStrength

Solution Approach 1:

The patent combines multiple fin pieces into a single continuous fin structure that follows the curved offset path. This eliminates gaps between fin pieces and reduces the number of assembly steps, thereby improving heat transfer efficiency while significantly reducing production time.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If abrupt turns are used in fin design, then manufacturing is simplified, but heat transfer efficiency is reduced due to fluid flow disruption

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidheat transfer efficiency

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent employs curved offset fins that follow a smooth radial path around the tube rather than using sharp angular transitions. This curved geometry eliminates abrupt fluid turns, improves heat transfer by maintaining continuous surface contact, and allows for more efficient manufacturing as a single piece.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly improves heat transfer efficiency by eliminating abrupt fluid turns and allowing for optimized fin design and placement, while also reducing production time and potential gaps between fin pieces.

Implementation Method 1

The cooling liquid transfers heat from the electronic components to the heat exchanger

Methodology Applied

Scientific EffectConduction: Conduction (thermal)

Implementation Method 2

liquid-flow-through cooling may be used up to 1000 watts heat generation

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

curved offset fin devices used within a fluid flow path within a heat exchanger that is in a liquid cooled electronics chassis

Methodology Applied

Scientific EffectHeat exchanger: Heat Exchanger

Data Source

PatentUS20250031343A1Electronic enclosure with improved heat transfer performance

Publication Date: 2025.01.23 EAGLE TECHNOLOGY LLC

AI summary

An electronic enclosure having improved cooling capacity using a radial fin pattern that is fabricated using additive manufacturing methods is disclosed.