Radiating Fin Cooling Module for Semiconductor Laser Heat Dissipation
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Solution Overview
Problem
Current liquid-cooled semiconductor lasers face challenges such as high production costs, difficulty in processing, short lifetime, and stringent sealing requirements due to their micro-channel structure, which limits their heat dissipation efficiency and reliability.
Innovation Solution
A novel cooling module with a radiating fin structure replaces the micro-channel design, using a liquid cooling plate with metal, ceramic, or composite materials, featuring a chip mounting area, heat sink, and insulating plate, along with a method for fabrication that includes electroplating and die bonding, to enhance heat dissipation and reduce production complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If micro-channel liquid cooling structure is used, then heat dissipation capability is improved, but production cost increases and processing difficulty increases
Solution Approach 1:
The invention changes the structural parameters of the cooling plate from micro-channel design to radiating fin design with optimized thickness (1-5mm) and fin spacing (2-10mm), achieving effective heat dissipation while significantly reducing processing difficulty and production cost
Solution Approach 2:
The invention employs composite material structure by combining radiating fins with the cooling plate body, using materials with different thermal properties in specific regions to optimize heat dissipation performance while maintaining manufacturing feasibility and controlling costs
2Loss of energy
If micro-channel liquid cooling structure is used, then heat dissipation capability is improved, but device complexity increases
Solution Approach 1:
The invention extracts the complex micro-channel internal structure and replaces it with external radiating fins, simplifying the overall device structure while maintaining effective heat dissipation capability and reducing manufacturing complexity
Solution Approach 2:
Instead of using internal micro-channels to dissipate heat, the invention inverts the approach by using external radiating fins, fundamentally changing the heat dissipation architecture from internal flow-based to external surface-based convection
3Loss of energy
If micro-channel liquid cooling structure is used, then heat dissipation capability is improved, but sealing requirements become more stringent
Solution Approach 1:
The invention removes the sealed micro-channel liquid flow path and replaces it with external radiating fins that dissipate heat through convection, eliminating the stringent sealing requirements while maintaining heat dissipation effectiveness
4Loss of energy
If micro-channel liquid cooling structure is used, then heat dissipation capability is improved, but lifetime decreases
Solution Approach 1:
The invention extracts the vulnerable micro-channel liquid cooling system and replaces it with a solid radiating fin structure, eliminating the risks of liquid leakage and channel blockage, thereby significantly improving device lifetime and reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces thermal resistance, increases heat dissipation capabilities, and lowers production costs while improving reliability and ease of maintenance, enabling higher power output and longer lifespan with simpler sealing requirements.
Implementation Method 1
A radiating fin is provided within the liquid inlet of the liquid cooling plate
Implementation Method 2
liquid cooling plate... featuring a chip mounting area, heat sink
Implementation Method 3
a heat sink and a chip are provided at the chip mounting area of the liquid cooling plate, with the heat sink attaching to a positive electrode surface of the chip
Implementation Method 4
a method for fabrication that includes electroplating and die bonding
Implementation Method 5
a method for fabrication that includes electroplating and die bonding
Data Source
AI summary
A cooling module for fabricating a liquid-cooled semiconductor laser, a fabricating method, and a semiconductor laser fabricated from the module are provided, wherein the cooling module for a laser makes use of a liquid cooling plate provided with radiating fins to cool the semiconductor chip. After replacement of the traditional micro-channel structure with the radiating fin structure, the cooling module effectively reduces the resistance to flow of the cooling liquid, remarkably lowers the pressure decrease of the cooling liquid, makes it easier to seal the cooling liquid, provides stronger heat dissipating capability, effectively prolongs the lifetime of the semiconductor laser, and enhances the output power and reliability of the semiconductor laser, alongside the advantages of simple fabrication and low production cost.