Layered mask windows drive lateral epitaxial growth that bends and stops dislocations, improving GaN epitaxial layer quality for power devices and LEDs.
A nested covering cap and peripheral adhesive layout block ambient and reflected light while preserving optical alignment and attachment reliability.
An integrated wavelength-converting frame removes the separate transmissive member to shrink light-emitting packages without losing conversion efficiency.
A diode-capacitor snubber stores surge energy from wiring inductance, enabling higher bypass-switch frequency without resistor heat or added size.
Direct bonding joins optical elements to LED semiconductor chips without adhesives, enabling precise beam shaping with lower loss and simpler assembly.
A discharge-time model sets only the needed capacitor pre-charge after emergency stop, cutting laser processing cycle delays.
Core-shell quantum nanowires cut defects and surface recombination, enabling stable, efficient green and amber InGaN emission.
A pre-shaped concave epitaxial base enables a curved resonant cavity that improves light confinement and optoelectronic efficiency.
A sealed package constrains the light receiving body to simplify substrate shaping, improve fixing accuracy, and prevent direct light leakage.
Monolithic emitter and receiver integration removes extra optics, cutting light loss while improving object detection and distance measurement.
A graded AlGaN electron-blocking and interlayer structure improves p-type hole injection while reducing nitrogen vacancies and hole trapping.
Shifted control signal timing and stretched photodiode voltages capture femtosecond pulse peaks accurately without costly high-speed ADCs.
A multi-surface phosphor member improves light extraction, luminance, and color uniformity by aligning incident and emission surfaces.