Silicon Cooling Apparatus for Laser Gain Medium
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Solution Overview
Problem
Conventional metal-based cooling apparatuses for laser systems face issues with corrosion, clogging, and deformation at high temperatures, making them unsuitable for compact laser systems with small form factor gain media.
Innovation Solution
A silicon-based thermal energy transfer apparatus with internal coolant flow channels and manifolds that surround the gain medium, using silicon components and optional layers of synthetic diamond or nanotubes for enhanced thermal conductivity and durability, along with a heat exchanger system to manage coolant flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional metal-based cooling apparatus (copper, aluminum, or metal alloy) are used, then thermal energy can be removed from the gain medium, but the cooling apparatus suffers from corrosion, clogging of coolant channel, and deformation at high temperature
Solution Approach 1:
The patent changes the material parameter of the cooling apparatus from conventional metals (copper, aluminum, alloy) to silicon-based material. This material substitution fundamentally alters the chemical and thermal properties, providing resistance to corrosion and deformation while maintaining effective thermal energy removal from the gain medium through the coolant flow channels.
Solution Approach 2:
The patent employs composite material structures including silicon-based cooling apparatus with optional synthetic diamond or nanotube layers. These composite structures combine the thermal conductivity benefits of silicon with the enhanced thermal performance and durability of diamond or nanotube coatings, creating a multi-layered solution that addresses both heat removal and structural reliability.
2Volume of moving object
If the laser system is made compact with small form factor gain media, then the system size is reduced, but the cooling apparatus becomes more susceptible to corrosion and clogging issues
Solution Approach 1:
The patent changes the material composition parameter from conventional metals to silicon-based material, which inherently resists corrosion and prevents clogging in the coolant channels. This material transformation allows the cooling apparatus to maintain reliability in compact configurations where conventional metals would deteriorate.
Solution Approach 2:
The patent applies different material properties to different parts of the cooling apparatus - the silicon-based bulk material provides structural stability and corrosion resistance, while optional synthetic diamond or nanotube layers on specific surfaces enhance thermal conductivity and provide additional protection against degradation in the high-stress coolant flow regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes thermal energy from the gain medium, preventing overheating and extending the lifespan of the laser system while maintaining compactness and avoiding corrosion and deformation issues.
Implementation Method 1
silicon-based first and second manifolds... first internal coolant flow channels... second internal coolant flow channels
Implementation Method 2
coolant flow channels fluidly connect the first primary side and the second primary side... coolant flow
Implementation Method 3
optional layers of synthetic diamond or nanotubes for enhanced thermal conductivity
Data Source
AI summary
Embodiments of silicon-based thermal energy transfer apparatus for a gain medium of a laser system are provided. In one aspect, a silicon-based thermal energy transfer apparatus includes silicon-based first and second manifolds each having internal coolant flow channels therein. When the first and second manifolds are coupled together, a first groove on the first manifold and a second groove on the second manifold form a through hole configured to receive the gain medium therein. The through hole has a polygonal cross section when viewed along a longitudinal axis of the gain medium.