Radiation Detector Adhesive Bonding for Gap Reduction
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Solution Overview
Problem
The existing radiation detecting devices with indirect conversion mechanisms face issues due to inadequate adhesive strength between sensor substrates and scintillators, leading to gaps and artifacts in image acquisition caused by temperature variations and vibrations.
Innovation Solution
A radiation detecting device with a sheet-like adhesive member that extends from the first surfaces to the side surfaces of adjacent sensor substrates, ensuring continuous adhesion and improved bonding between the sensor substrates and scintillator, reducing the occurrence of gaps and image artifacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a sheet-like adhesive member is used to adhere sensor substrates and scintillator, then adhesive strength is improved, but the adhesive member may still peel due to temperature variations and vibration causing gaps
Solution Approach 1:
The adhesive member extends not only on the first surfaces of sensor substrates but also on their side surfaces, transitioning from a two-dimensional planar adhesion to a three-dimensional multi-surface adhesion. This dimensional extension ensures continuous adhesion even when substrates experience thermal expansion or vibration, preventing gap formation at boundaries.
Solution Approach 2:
The adhesive member is selectively positioned to cover specific regions: the first surfaces and side surfaces of sensor substrates, and the opposing surface of the scintillator. This localized quality distribution ensures adhesion is applied precisely where gaps are most likely to form, optimizing reliability without unnecessary material usage.
2Manufacturing precision
If adhesive member extends continuously from first surfaces to side surfaces, then gaps are reduced, but manufacturing complexity increases
Solution Approach 1:
The adhesive member is implemented as a thin film that can conform to multiple surfaces including planar first surfaces and vertical side surfaces. This flexible thin film structure allows continuous adhesion coverage across different orientations without requiring complex multi-component adhesive systems, simplifying manufacturing while maintaining precision.
3Reliability
If adhesive member covers side surfaces of sensor substrates, then adhesion reliability improves, but material usage increases
Solution Approach 1:
The adhesive member extends partially onto the side surfaces of sensor substrates rather than covering the entire perimeter or extending to the bottom. This partial action provides sufficient adhesion reliability to prevent peeling under temperature and vibration stress while minimizing unnecessary material consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the adhesive strength and reduces image artifacts by ensuring continuous adhesion between sensor substrates and scintillators, even under varying conditions like temperature and vibration, resulting in improved image quality.
Implementation Method 1
a scintillator that converts radiation into light that is detectable by the photoelectric converting elements
Implementation Method 2
a sensor substrate where a plurality of photoelectric converting elements are arranged in an array
Data Source
AI summary
A radiation detecting device in which defective adhesion between an adhesive member and end portions of a plurality of sensor substrates is reduced.A radiation detecting device includes a plurality of sensor substrates disposed adjacent to each other, each sensor substrate including a side surface that connects a first surface, where a plurality of photoelectric converting elements are arranged in an array, and an opposing second surface to each other; a scintillator disposed at a side of the first surfaces of the plurality of sensor substrates; and a sheet-like adhesive member for adhering the plurality of sensor substrates and the scintillator to each other, wherein, between the plurality of sensor substrates, the sheet-like adhesive member adheres to the first surfaces and at least portions of the side surfaces such that the sheet-like adhesive member extends and continuously adheres from the first surfaces to the at least portions of the side surfaces.