Radiation Detector Module Shielding Films
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Solution Overview
Problem
Radiation detectors for X-ray inspection devices face challenges in protecting integrated circuit readout circuits from radiation, as incident X-rays can pass through the scintillator and reach the circuits, causing abnormalities, and existing shielding configurations complicate wiring between the photoelectric conversion device and integrated circuit device.
Innovation Solution
A radiation detector module with a scintillator, two-dimensionally arrayed photoelectric conversion regions, a connection substrate with dielectric layers and metallic through conductors, and integrated circuit device with unit circuit regions separated to minimize radiation exposure, using metallic radiation shielding films integrated with through conductors to protect the readout circuits without obstructing wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a radiation shield is provided to cover the whole integrated circuit device, then the readout circuits are protected from radiation, but the wiring becomes complicated as it must bypass the radiation shield
Solution Approach 1:
The integrated circuit device is divided into unit circuit regions that are separated from each other, with each region protected by its own radiation shielding film. This segmentation allows wiring to pass through the spaces between regions without needing to bypass a large continuous shield, thus reducing wiring complexity while maintaining radiation protection.
Solution Approach 2:
Instead of providing a uniform radiation shield over the entire integrated circuit device, radiation shielding films are selectively placed only at locations where unit circuit regions are present. This localized approach protects sensitive circuits while leaving open spaces for simplified wiring routing.
2Volume of moving object
If the photoelectric conversion device and integrated circuit device are mounted on opposite surfaces of the substrate, then downsizing is achieved, but radiation can pass through the substrate to reach the integrated circuit device
Solution Approach 1:
Radiation shielding films are embedded within the substrate structure at multiple interlayer positions, creating nested protection layers between the photoelectric conversion device and the integrated circuit device. This nested configuration blocks radiation paths while maintaining the compact stacked architecture.
Solution Approach 2:
Radiation shielding is implemented in the vertical dimension by placing shielding films at multiple interlayer positions within the substrate thickness, rather than relying solely on horizontal substrate material. This multi-layer vertical arrangement effectively blocks radiation while preserving the compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively protects readout circuits from radiation with a simple configuration, reducing noise and parasitic capacitance, and minimizing the need for complex wiring, thereby enhancing the reliability and efficiency of the radiation detector.
Implementation Method 1
a scintillator for converting radiation to light
Implementation Method 2
a photoelectric conversion device having a plurality of photoelectric conversion regions arrayed two-dimensionally, and for receiving light from the scintillator at the photoelectric conversion regions
Data Source
Figure 1
Figure 2
Figure 3(a)~3(b)
AI summary
A radiation detector module 10A includes a scintillator for converting radiation made incident from a predetermined direction to light, a two-dimensional PD array 12 for receiving light from the scintillator, a connection substrate 13 formed by stacking dielectric layers 130a to 130f, and mounted with the two-dimensional PD array 12 on one substrate surface thereof, and an integrated circuit device 14 mounted on the other substrate surface of the connection substrate 13, and for reading out electrical signals output from the two-dimensional PD array 12. The integrated circuit device 14 has a plurality of unit circuit regions 14b separated from each other. The connection substrate 13 has a plurality of through conductors 20 and a plurality of radiation shielding films 21a to 23a formed integrally with each of the plurality of through conductors 20 and separated from each other. Accordingly, the readout circuits of the integrated circuit device can be protected from radiation with a simple configuration.