Radiation Detector Substrate Segmentation for Yield Improvement
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Solution Overview
Problem
The existing radiation detectors with integrated AEC sensors suffer from high manufacturing costs and reduced yield due to defects, as both the radiation detecting pixels and AEC sensors are formed on the same substrate, leading to discarding of entire substrates even if only AEC sensors are defective.
Innovation Solution
Separating the radiation detecting pixels and AEC sensors onto different substrates, allowing only the defective AEC sensor substrate to be discarded while the radiation detecting pixel substrate remains usable, thus reducing manufacturing costs and enhancing detection area and sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If AEC sensors are formed on the same substrate as radiation detecting pixels, then integration and compactness are improved, but manufacturing cost increases and yield decreases due to defects in AEC sensors causing entire substrate rejection
Solution Approach 1:
The patent divides the radiation detection system into two separate substrates: one substrate contains the radiation detecting pixels arranged in a matrix, while another substrate contains the AEC sensors. This segmentation allows independent manufacturing and inspection of each substrate, so that defects in AEC sensors do not cause rejection of the entire assembly, thereby reducing manufacturing cost and improving yield while maintaining integrated functionality.
2Area of moving object
If AEC sensors are formed on the same substrate as radiation detecting pixels, then integration is improved, but manufacturing yield decreases because defects in AEC sensors or lines cause entire substrate to be discarded
Solution Approach 1:
The patent divides the radiation detection system into two separate substrates: one substrate contains the radiation detecting pixels arranged in a matrix, while another substrate contains the AEC sensors. This segmentation allows independent manufacturing and inspection of each substrate, so that defects in AEC sensors do not cause rejection of the entire assembly, thereby reducing manufacturing cost and improving yield while maintaining integrated functionality.
3Area of moving object
If AEC sensors are formed in gaps between radiation detecting elements, then integration is achieved, but detection area of radiation detecting pixels is reduced
Solution Approach 1:
The patent moves the AEC sensors from the two-dimensional plane of the radiation detecting pixel substrate to a separate third substrate positioned behind the radiation detecting elements. This dimensional relocation allows AEC sensors to detect radiation transmitted through the patient without occupying space that would reduce the active detection area of the radiation detecting pixels, thereby maintaining full pixel area while achieving AEC functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This separation reduces manufacturing costs, improves radiation detection accuracy, and increases detection sensitivity by allowing the AEC sensors to cover the entire gaps between radiation detecting pixels, receiving more radiation and reducing differences in pixel and irradiation amount detection.
Implementation Method 1
a wavelength conversion unit that converts irradiated radiation having a first wavelength into radiation having a second wavelength
Implementation Method 2
a plurality of radiation detecting pixels, disposed in a matrix on the first surface, that accumulate charges generated due to irradiation of the radiation having the second wavelength
Implementation Method 3
a plurality of radiation irradiation detecting sensors that generate charges due to irradiation of the radiation having the second wavelength being irradiated onto the first surface and emitted from the second surface
Data Source
AI summary
The present invention provides a radiation detector including: a wavelength conversion unit that converts irradiated radiation to a radiation with a second wavelength; a first substrate that has a first and a second surface; radiation detecting pixels, disposed in a matrix on the first surface, that accumulate charges generated by irradiation of the radiation with the second wavelength, and that include switching elements to read out the charges; scan lines, provided on the first surface, through which a control signal, that switches each switching element provided in each radiation detecting pixel, flows; signal lines, provided on the first surface, through which an electric signal flows, the electric signal corresponding to the charges accumulated in each radiation detecting pixel; and a second substrate, provided on the second surface, that includes radiation irradiation detecting sensors that generate charges due to irradiation of the radiation having the second wavelength.