Radiation Detector Substrate Shielding for Electronics Reliability

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Solution Overview

Problem

Existing radiation detection systems face challenges in protecting electronic components from radiation damage, which can lead to reduced lifespan and performance.

Innovation Solution

The implementation of a radiation scanning system that includes a radiation detection sub-assembly coupled with a routing sub-assembly, featuring a first and second substrate with radiation shields between them, and semiconductor dice connected to the second substrate to shield electronic components from radiation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If radiation shields are added between substrates to protect electronic components, then reliability of electronic components is improved, but device complexity increases

Engineering Contradiction:

Improvereliability of electronic componentsVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The radiation shields are nested within the routing sub-assembly structure, positioned between the first and second substrates. This integration allows the shields to be incorporated into the existing multi-layer substrate architecture without requiring separate external shielding structures, thereby protecting electronic components while minimizing additional complexity.

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

The routing sub-assembly acts as an intermediary structure between the radiation detection sub-assembly and the electronics sub-assembly. By placing radiation shields within this intermediate routing layer, the design provides radiation protection to electronic components while maintaining the functional separation and signal routing pathways between different subsystems.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If multiple substrates and shields are integrated in the routing sub-assembly, then protection of electronic components is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveradiation exposure to electronic componentsVSAvoidease of manufacture

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The system is segmented into distinct functional sub-assemblies: the radiation detection sub-assembly, the routing sub-assembly (containing first and second substrates with embedded shields), and the electronics sub-assembly. This segmentation allows each component to be manufactured and tested independently before final integration, reducing overall manufacturing complexity despite the multi-layer structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The routing sub-assembly employs a composite structure combining radiation-shielding materials with standard PCB substrate materials. This composite approach provides effective radiation protection while maintaining compatibility with conventional manufacturing processes for substrate assembly and electronic component mounting.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces radiation exposure to electronic components, enhancing their durability and the overall performance of the radiation detection system.

Implementation Method 1

one or more radiation shields between the first substrate and the second substrate

Methodology Applied

Scientific EffectRadiation shielding: Absorption (EM radiation)

Data Source

PatentUS12298451B2Radiation detectors for scanning systems, and related scanning systems

Publication Date: 2025.05.13 ANALOGIC CORP

AI summary

A radiation scanning system comprises a radiation detection sub-assembly, and a routing sub-assembly coupled to the radiation detection sub-assembly. The radiation detection sub-assembly comprises a first substrate electrically connected to the radiation detection sub-assembly, and a second substrate electrically connected to the first substrate. The radiation scanning system further comprises one or more radiation shields between the first substrate and the second substrate, and one or more semiconductor dice electrically connected to the second substrate on a side of the second substrate opposite the first substrate. Related radiation detector arrays radiation scanning systems are also disclosed.