Radiation Mask for Selective PCB Inspection
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Solution Overview
Problem
The challenge is to inspect printed circuit boards for defects without causing damage from radiation, as advanced electronic components become increasingly sensitive to X-ray inspection, leading to reliability and performance issues.
Innovation Solution
A radiation mask with first and second segments is used to selectively attenuate radiation, allowing for defect detection while minimizing exposure to sensitive semiconductor devices, by adjusting attenuation levels based on the presence or absence of these devices on the board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If X-ray radiation inspection is used to detect defects in printed circuit boards, then defect detection capability is improved, but reliability of sensitive semiconductor devices deteriorates due to radiation damage
Solution Approach 1:
The patent divides the printed circuit board into multiple regions based on radiation sensitivity, with sensitive semiconductor devices identified and segregated into protected zones. This segmentation allows differential radiation exposure strategies to be applied to different board regions, enabling defect detection in non-sensitive areas while protecting sensitive components.
Solution Approach 2:
The patent implements location-dependent radiation attenuation by positioning variable attenuation elements at specific locations corresponding to sensitive device regions. This creates locally differentiated radiation exposure, where high attenuation is applied only in regions containing sensitive semiconductor devices while allowing full inspection radiation in other areas, thus maintaining both detection capability and device reliability.
2Reliability
If radiation attenuation is increased to protect sensitive semiconductor devices, then reliability is improved, but defect detection capability deteriorates
Solution Approach 1:
The patent employs variable or adjustable attenuation elements that can dynamically modify radiation attenuation levels. This allows the system to optimize the balance between protection and detection by adjusting attenuation characteristics based on the specific inspection requirements and sensitivity of different device regions, rather than using fixed attenuation throughout.
Solution Approach 2:
The patent introduces variable attenuation elements as intermediary components between the radiation source and the semiconductor devices. These intermediaries selectively modulate radiation intensity, allowing sufficient radiation to pass through for defect detection while providing adequate attenuation to protect sensitive devices, thus mediating between the conflicting requirements.
3Reliability
If uniform radiation attenuation is applied across the entire board, then protection of sensitive devices is improved, but inspection effectiveness deteriorates due to reduced radiation in non-sensitive areas
Solution Approach 1:
The patent segments the printed circuit board into distinct regions based on the presence and sensitivity of semiconductor devices. This spatial segmentation enables the application of different radiation attenuation levels to different board regions, ensuring adequate protection for sensitive devices while maintaining full inspection capability in non-sensitive areas, thus avoiding the productivity loss associated with uniform attenuation.
Solution Approach 2:
The patent implements location-specific radiation attenuation characteristics, where attenuation levels are tailored to the local requirements of each board region. Areas containing sensitive semiconductor devices receive higher attenuation, while areas without sensitive devices receive minimal or no attenuation, optimizing both protection and inspection effectiveness simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables effective defect identification on printed circuit boards without degrading the performance of sensitive semiconductor devices, by controlling radiation exposure through the use of a radiation mask with varying attenuation levels.
Implementation Method 1
a first segment configured to pass a first portion of radiation emitted towards a first sectional area of a PCB... attenuate the first portion with a first attenuation level
Data Source
AI summary
Masks that selectively attenuate radiation for inspections of printed circuit boards (PCB) are disclosed. A PCB may be inspected for defects by exposing the PCB with radiation and analyzing the radiation transmitted through the PCB. By employing a radiation mask having first and second segments between the PCB and a radiation source, the radiation may be selectively attenuated to attenuate a first portion of the radiation with a first attenuation level to prevent performance degradation to sensitive semiconductor devices as part of a first sectional area of the PCB, and yet provide substantially non-attenuation or attenuation at a second attenuation level for a second portion of the radiation incident upon a second sectional area of the PCB which is free from sensitive semiconductor devices. In this manner, the selective attenuation enables inspection of the first and second sectional areas of the PCB without damage to the sensitive semiconductor devices.