Radiation Sensor Contact Layer Design for Compact Stability
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Solution Overview
Problem
Existing optical sensors with radiation-detecting semiconductor chips face challenges in achieving a compact design and high reliability due to the use of bond wires for connections, which occupy space and are prone to instability under temperature fluctuations.
Innovation Solution
A sensor design featuring a printed circuit board with radiation-detecting semiconductor chips connected via a contact layer instead of bond wires, including an embedding layer and contact layers to facilitate a more compact and stable structure, suitable for applications in limited spaces and varying temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bond wires are used to connect the front-side contact of the semiconductor chip to the printed circuit board, then the connection is established, but the structural height increases and stability decreases under temperature fluctuations
Solution Approach 1:
The patent removes the bond wire connection method and replaces it with a direct contact layer integration. The front-side contact of the semiconductor chip is connected directly to the contact layer on the printed circuit board, eliminating the intermediate bond wire structure that contributes to height and reliability issues.
Solution Approach 2:
The contact layer is integrated directly with the printed circuit board structure, merging the connection function into the board itself rather than using separate bond wires. This integration reduces the overall structural height while improving connection stability under temperature variations.
2Reliability
If bond wires are used for connecting semiconductor chips, then electrical connection is achieved, but the sensor occupies more space and reliability decreases
Solution Approach 1:
The bond wire component is completely removed from the sensor structure. The electrical connection is achieved through the contact layer that is directly integrated into the printed circuit board, eliminating the space-consuming bond wires while improving connection reliability.
Solution Approach 2:
The connection approach transitions from a three-dimensional wire structure (bond wires extending in space) to a two-dimensional planar contact layer structure on the printed circuit board, reducing the volume occupied by connection elements while maintaining electrical connectivity.
3Volume of moving object
If a compact sensor design is implemented, then space is saved, but the structural stability under temperature fluctuations may be compromised
Solution Approach 1:
The contact layer is merged with the printed circuit board structure, creating an integrated assembly that maintains structural stability. This integration ensures that the compact design does not compromise stability, as the contact layer and board move together as a unified structure under temperature fluctuations.
Solution Approach 2:
The sensor employs a composite structure combining the semiconductor chip, contact layer, and printed circuit board materials. This composite construction provides thermal expansion compatibility and structural stability while maintaining a compact form factor suitable for space-constrained applications.
Data Source
AI summary
A sensor includes a printed circuit board; at least one semiconductor chip arranged on the printed circuit board and includes a front-side contact, wherein the semiconductor chip is a radiation-detecting semiconductor chip; an embedding layer arranged on the printed circuit board and laterally adjoining the at least one semiconductor chip; and a contact layer connected to the front-side contact of the at least one semiconductor chip.