Radiator With Varying Tube Widths For Compact Heat Dissipation

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Solution Overview

Problem

In electronic apparatuses, the limited installation space for radiators poses a challenge in securing sufficient heat dissipation, as traditional radiator designs struggle to enhance cooling capacity without increasing size or interfering with other components.

Innovation Solution

The radiator design features a header with a supply and discharge chamber, and stacked tubes with varying widths, where the upper tubes have a greater surface area than the lowermost tubes, allowing for efficient heat dissipation while minimizing height and avoiding interference with other components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the radiator's height is increased to provide more tubes for heat dissipation, then the heat dissipation capacity is improved, but the installation space requirement increases and interference with other components occurs

Engineering Contradiction:
Improveheat dissipation capacityVSAvoidradiator height
Core Design Contradiction:
PowerVSLength of stationary object

Solution Approach 1:

The patent applies local quality by making the tube widths non-uniform along the height of the radiator. Specifically, the tube width increases from the lowermost tube upward, creating localized variations in heat dissipation capacity. This allows the radiator to optimize heat dissipation in different vertical zones without uniformly increasing the overall height, thereby improving heat dissipation capacity while controlling the radiator's vertical dimension.

Inventive Principle:
Principle #3Local quality

2Power

If the number of tubes is increased to enhance cooling capacity, then the heat dissipation capacity is improved, but the device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improveheat dissipation capacityVSAvoidradiator structure complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent segments the radiator into multiple tubes with different width specifications along the vertical direction. The tubes are divided into at least two groups: lowermost tubes with a first width and upper tubes with a second (larger) width. This segmentation allows the design to achieve enhanced heat dissipation capacity through multiple tubes while managing complexity by organizing them into structured groups with systematic dimensional variations.

Inventive Principle:
Principle #1Segmentation

3Power

If the tube width is increased to provide greater surface area for heat dissipation, then the heat dissipation capacity is improved, but the radiator's overall size and installation space requirement increase

Engineering Contradiction:
Improveheat dissipation capacityVSAvoidradiator footprint area
Core Design Contradiction:
PowerVSArea of stationary object

Solution Approach 1:

The patent transitions from uniform two-dimensional tube cross-sections to a three-dimensional configuration where tube width varies along the vertical dimension. By increasing tube width in the horizontal direction for upper tubes while utilizing the vertical stacking arrangement, the design achieves greater total surface area for heat dissipation without proportionally increasing the radiator's horizontal footprint, thus improving heat dissipation capacity while controlling the installed area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances heat dissipation capacity within limited spaces, reducing the radiator's thickness and size while ensuring effective cooling, even in densely packed electronic equipment.

Implementation Method 1

a radiator to dissipate heat of a coolant to cool an electronic part mounted on a circuit board

Methodology Applied
Scientific EffectHeat dissipation: Thermal Radiation

Implementation Method 2

a cooling plate thermally connected to the electronic part

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9313919B2Radiator, electronic apparatus and cooling apparatus
Publication Date: 2016.04.12 FUJITSU LTD
  • US9313919B2 patent drawing
  • US9313919B2 patent drawing
  • US9313919B2 patent drawing

AI summary

A radiator includes a header including a supply chamber for a coolant to cool an electronic part mounted on a circuit board and a discharge chamber partitioned from the supply chamber, and a plurality of tubes stacked in a heightwise direction of the header, one end of each of the plurality of tubes being connected to the supply chamber and the other end of each of the plurality of tubes being connected to the discharge chamber, and the coolant flowing from the one end to the other end. The plurality of tubes include a first tube at least including a lowermost tube, and a second tube provided over the first tube and having a surface area greater than that of the first tube.