Radio Communication Apparatus Layered Dielectric Antenna
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Solution Overview
Problem
Existing radio communication apparatuses with integrated RF circuits and antennas on a single printed board face issues with signal quality due to transmission losses, particularly when forming the RF circuit, and require complex wiring structures that increase manufacturing difficulty and cost.
Innovation Solution
A radio communication apparatus with an RF circuit on one surface of a printed board and antennas on the other, featuring layered dielectric substrates with metal films and through holes, where transmission lines are routed directly to the antennas without intersecting wiring, reducing transmission loss and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If RF circuit and antennas are integrally formed on one printed board, then circuit size is reduced and transmission loss is reduced, but manufacturing complexity and wiring complexity increase
Solution Approach 1:
The patent utilizes the thickness dimension of the printed board to route transmission lines. By forming transmission lines on both the front surface and back surface of the board, and allowing them to pass through or along the thickness direction, the wiring complexity is reduced while maintaining the integrated structure. This dimensional approach allows RF signals to be transmitted from the RF circuit to the antennas without complex planar routing.
2Adaptability or versatility
If patch antennas are used to form antennas on the printed board, then integration is achieved, but bandwidth becomes narrow and transmission loss remains large
Solution Approach 1:
The antenna is segmented into multiple independent radiating elements (first antenna element and second antenna element) that are separately formed on the printed board. Each element can be independently optimized for different frequency bands or functions, thereby increasing the overall bandwidth and signal quality while maintaining integration with the RF circuit.
Solution Approach 2:
The patent employs composite structure combining conductive materials for antenna elements, dielectric materials for the printed board, and potentially metallic layers for grounding and shielding. This composite approach enables the antenna to achieve wider bandwidth and lower transmission loss while remaining integrally formed on the printed board with the RF circuit.
3Reliability
If complex wiring structure is used to connect RF circuit and antennas, then signal transmission is achieved, but manufacturing difficulty and cost increase
Solution Approach 1:
The transmission lines are merged with the antenna elements themselves. The antenna elements serve dual functions as both the radiating structures and the transmission paths for RF signals. This merging eliminates the need for separate complex wiring structures, thereby reducing manufacturing difficulty and cost while ensuring reliable signal transmission from the RF circuit to the antennas.
Data Source
AI summary
A radio communication apparatus includes a printed board, an RF circuit formed on one surface of the printed board and configured to generate an RF signal, a first transmission line configured to transmit the RF signal, a second transmission line configured to transmit a signal different from the RF signal, and an antenna formed on another surface of the printed board and configured to emit the RF signal. The antenna includes a plurality of dielectric substrates layered on the other surface of the printed board, a metal film formed on surfaces of the plurality of dielectric substrates, and a through hole formed in at least the dielectric substrate adjacent to the printed board. The first transmission line is disposed on the one surface of the printed board, and a part of the second transmission line is disposed between any of the plurality of layered dielectric substrates.